High Efficiency Polishing Of Zirconia Ceramics With Magnetic Compound Fluid Assisted By Dielectrophoresis

In recent years,with the rapid development of social economy,China has made great progress in the fields of aerospace,automobile,electronics,new energy and biomedicine.Zirconia ceramic materials have excellent properties such as high strength,low density,high temperature resistance,wear resistance,no electromagnetic shielding,chemical stability and good biocompatibility.However,due to the limitation of current processing methods,there are still many problems in the production of ultra-precision zirconia ceramics devices without sub-surface damage in high efficiency and mass production.The existing processing technology of zirconia ceramics mainly includes grinding,ultrasonic-assisted grinding,laser-assisted grinding,and so on.In assisted grinding and polishing,there are more or less problems,such as low surface finish,obvious machining traces,serious sub-surface damage and so on.In order to solve the above-mentioned problems,the magnetic compound fluid polishing technology has been applied to ultra-precision damage-free machining of zirconia ceramics by applying the traditional polishing method to surface polishing.In order to further improve the polishing efficiency,the phenomenon of dielectric electrophoresis in the traditional sense of biology and chemistry was introduced into the magnetic composite fluid polishing technology.Through the phenomenon of dielectric electrophoresis of abrasive particles,the distribution dencity of abrasive particles acting on the work-surface in the polishing area can be improved,thus improving the polishing efficiency in the process of magnetic compound fluid polishing.Through the experiment of polishing zirconia ceramic workpieces with magnetic compound fluid,the influence of main parameters on polishing results is obtained,and the experimental results are analyzed and summarized.By adjusting the experimental parameters,the polishing process is carried out for 30 min by using magnetic compound fluid polishing technology.The Ra value of zirconia ceramic workpiece surface is changed from the original 65 nm to 8 nm,and the polished workpiece surface is free of burrs and scratches and so on.When the polished workpiece surface is further subdivided,it can be found that the line roughness of the inner circular layer with low material removal rate can reach 0.689 nm,and the glossiness can reach 279.6 GU.It can also be seen that magnetic compound fluid polishing technology can meet the requirements of ultra-precision and high-quality zirconia ceramics in the field of high-precision and high-quality Zirconia ceramics.After the introduction of dielectrophoresis,we found that the shape of the electrodeand the size of the voltage had a significant impact on the polishing results.When the circular electrode with a diameter of 20 mm was selected and the voltage was set at 1500 V,the material removal efficiency increased by about 36.4% compared with that when the electrode was not energized.