Study On Thermal Interface Application Of Sn-Bi/Graphene Composites Based On High Thermal Conductivity

Thermal Interface Material(TIM)is the key to achieving efficient thermal management of the electronic system.In addition to high thermal conductivity,TIM requires good interfacial heat transfer performance and mechanical properties to meet practical applications.In this paper,a new high thermal conductivity low melting point alloy TIM-SnBi/Graphene(SnBi/GNS)composite was studied,and the interfacial heat transfer performance and mechanical properties of the composite were further studied.The main contents are as follows:a)The variation of interface thermal resistance of Cu-SnBi/GNS-Cu three-layer structure samples under the peak temperature(220?,240?,260?)and contact pressure(2g,3g)of different sample preparations were studied..The results show that when the peak temperature is raised from 220 ? to 260 ?,the interface thermal resistance of Cu-SnBi/GNS-Cu samples is reduced by 50.7%;when the contact pressure is increased from 2g to 3g,the interface thermal resistance is reduced by 31.5%.When the peak temperature is 260? and the contact pressure is 3g(237Pa),the interfacial heat transfer performance of the Cu-SnBi/GNS-Cu sample is the best.The heat transfer performance of Cu-SnBi/GNS-Cu samples is very stable in the test temperature range of 60? ~ 100?,showing its high reliability in high temperature environment.In addition,infrared imaging technology was used to compare the heat transfer performance of SnBi/GNS composites and the high-performance thermal grease and thermal silica gel pads in current market at different heat source powers.The results show that the heat transfer performance of Cu-SnBi/GNS-Cu samples is always the best under different powers.With the increase of power,the difference of the heat transfer performance is more obvious between different samples.b)The effects of different peak temperatures(220?,240?,260?)and holding time(2min,5min,10min)on the interfacial bonding strength of Cu-SnBi/GNS samples were investigated.The results show that when the peak temperature is raised from 220? to 260?,the bonding strength of the Cu-SnBi/GNS sample is increased by 39.2%;when the holding time is extended from 2 min to 5 min,the bonding strength of the sample is increased by 34.5%.When the peak temperature is 260? and the holding time is 5min,the bonding strength of the Cu-SnBi/GNS sample is the largest.c)The variation of tensile strength of SnBi/GNS and SnBi samples at different heat aging temperatures was studied.The results show that the presence of GNS effectively inhibits the heat aging process of the sample.Under the heat aging treatment at 100 ?,the anti-aging performance of SnBi/GNS was improved by 27.7%.Under the heat aging treatment at 120 ?,the anti-aging performance of SnBi/GNS was improved by 21.7%.