Research On Cutting Method And Technology Of Adaptive Diamond Wire Saw

With the rapid development of scientific research and industrial technology,the application of hard and brittle materials in various fields is increasingly popular.They are widely used in energy,information,manufacturing and architectural decoration and other fields.The problems of low processing efficiency,poor surface integrity and high production cost seriously restrict their application in modern industry.Due to its excellent physical and chemical properties,high hardness and wear resistance,sapphire materials have been widely used in electronic,optical,military,aerospace,medical and other fields.Therefore,the processing of sapphire crystal has attracted more and more attention.At present,the efficiency and surface quality of sapphire chips are required more and more in various fields.This paper studies a diamond wire saw cutting technology,which has the advantages of wide machining range,high sawing efficiency,small bending deformation,good surface quality,processing irregular and large-diameter workpiece.In order to meet the market demand for sapphire application and improve the quality of sapphire chip,this paper studies the main processing parameters of sapphire,analyzes the relationship between the process parameters and the surface quality of workpiece,and optimizes them by orthogonal design to obtain the optimal process parameters,which provides theoretical support for the high-quality and high-efficiency material chip technology.The specific research content of this paper is as follows:1.Analysis of cutting mechanism of adaptive diamond wire saw.Based on the indentation fracture model,the pressure head test of sapphire is carried out to analyze the causes of cracks in hard and brittle materials under the action of a single abrasive.The cutting mechanism of adaptive diamond wire saw is analyzed.The single abrasive cutting model,material removal rate model and cutting efficiency model are established,and the relationship between removal rate and cutting efficiency is analyzed.2.Adaptive diamond wire saw cutting method.An adaptive diamond wire saw cutting method is invented.The tensioning wheel is equipped with a micro pressure sensor.The thrust can be displayed in real time by pushing the tensioning wheel through the cylinder,the pressure can be monitored,the pressure sensor value can be observed,and the tension can be adjusted in time to restore the constant tension of the saw wire without horizontal feed.The cylinder control and the force measuring device are connected by PLC.During the cutting process,the force measured by the force measuring device changes.The PLC feeds the signal back to the cylinder control end.The two position three-way single air control valve is used to control the expansion and contraction of the single acting cylinder.The cylinder is connected with the magnetic switch to realize the position control of the cylinder.3.Development of adaptive diamond wire saw cutting equipment.According to the design requirements and working principle of the adaptive diamond wire saw,the adaptive diamond wire saw cutting equipment is developed.The main contents of the equipment development include the overall scheme design,the control system module design,the feed module design,the guide module design,the tension module design and the force measurement module design.4.Simulation of diamond wire saw cutting.Based on the finite element analysis software ABAQUS,the fracture separation principle and realization method of materials are analyzed.A two-dimensional simulation model of cutting sapphire with single abrasive is established to simulate the cutting process of single abrasive and obtain the machined surface morphology.The cutting force,workpiece stress field,workpiece surface residual stress and surface morphology are analyzed during the cutting process.5.Adaptive diamond wire saw cutting process parameters optimization.According to the pre research experimental data,the range of process parameters is preliminarily determined,and the single factor experiment is designed to study the influence of three factors on the surface quality of sapphire crystal,namely the wire speed,cylinder pressure and wire diameter.Each factor is taken as three levels,and the orthogonal experiment is designed to optimize the processing parameters of sapphire crystal cut by the wire saw.