Process Study On Minimal Quantity Lubrication Based On Diamond Wire Saw

Diamond wire saw cutting technology is an emerging technology for cutting hard and brittle materials.It can be widely used in the slicing process of monocrystalline silicon,and has the advantages of high cutting efficiency,low slicing loss,and high slicing accuracy.Slicing is an important process for turning silicon rods into silicon wafers.The quality of silicon wafers directly affects the subsequent processing costs.In order to further reduce the cost and improve the surface quality of the slices,try to apply the Minimal Quantity Lubrication(MQL)to the wire saw cutting.The preliminary research experiments show that the MQL can improve the cutting efficiency of the wire saw and reduce the surface roughness of the slice.Therefore,it is necessary to conduct in-depth research on the diamond wire saw cutting with MQL.In order to further analyze the machining mechanism and process performance of the diamond wire saw cutting with MQL,and to optimize the processing parameters,the relevant research on the diamond wire saw cutting process with MQL is carried out in combination with simulation and experiments.The main research work is as follows:First,the diamond saw wire cutting model is established.Analyze the mechanism of diamond particles cutting monocrystalline silicon,sawing efficiency,MQL mechanism,etc.It provides conditions for further using simulation software to simulate the diamond wire saw cutting process under the condition of MQL.Secondly,based on the diamond wire saw cutting equipment,design a MQL system and build an experimental platform;Set up an experimental platform;The MQL mechanism mixes the lubricant and compressed air through the mixer to form oil mist droplets,which are continuously and micro-injected into the lubrication area under the drive of high-speed gas;Configure lubricating fluid,optimize the proportion of each component through single factor experiment,and provide conditions for the next step of MQL cutting monocrystalline silicon experiment.In addition,analysis and calculation based on the brittle cracking model of ABAQUS.The finite element simulation analysis of the diamond wire saw cutting process under the condition of MQL.Establish a two-dimensional simulation model of diamond particles cutting monocrystalline silicon under MQL conditions.Analyze the cutting force and the surface morphology after processing under different lubrication conditions to provide a basis for processing process parameters.Finally,the diamond wire saw cutting experiments with MQL are performed.Taking wire speed and feed speed as factors,design orthogonal experiments to obtain optimized processing parameters;On this basis,taking nozzle angle,lubricating flow,and nozzle aperture as factors,orthogonal experiments were designed to study the influence of different MQL parameters on the surface roughness of the slices,and an optimized MQL process plan was obtained.