Research On Comprehensive Evaluation Of Micro-grinding Quality Of Single Crystal Silicon Micro-groove Array

Micro-array structure is widely used in advanced manufacturing fields like biomedicine,aviation industry,electronic communication and lubrication because of its superior performance.With the development of advanced manufacturing technology,the requirement of its three-dimensional shape processing qualities such as complexity,surface quality,and dimension accuracy is constantly increasing.Therefore,the evaluation of the processing quality of micro-array structure is becoming more and more important.Monocrystalline silicon microgroove arrays play an important role in microelectronic heat dissipation,reactor,and optical components due to their excellent thermal conductivity and optical functions.However,monocrystalline silicon is typically hard and brittle and the surface defects in terms of edge collapse and angle gap easily occur during the grinding process,which affects the causative performance of micro-array structure.In this paper,single crystal silicon micro-groove array is taken as the research object,and the processing quality of monocrystalline silicon micro-groove array is comprehensively evaluated,providing theoretical reference and experimental basis for the optimization of micro-grinding process for monocrystalline silicon micro-arrays.The main work includes:(1)As to the edge collapse which is easy to occur in the micro-grinding processing of monocrystalline silicon micro-groove,the edge damage evaluation method by combining image binaryzation processing with the calculation principle of surface roughness is introduced,and the edge damage evaluation model of the micro-groove's edge collapse is established.(2)From the perspectives of surface integrity,dimensional accuracy,processing efficiency and quality stability of micro-groove arrays,the quality evaluation system for micro-grinding of monocrystalline silicon micro-groove array is established with the surface roughness of groove,edge damage,groove width variation,processing efficiency,and standard deviation of micro-arrays' surface roughness,edge damage and groove width variation as the evaluation indexes.And the gray correlation analysis method is determined as a comprehensive evaluation method according to the characteristics of the evaluation objects' properties and data information.(3)With feed rate,micro-groove depth and spindle speed as the experimental factors,the single factor experiment of micro-grinding of micro-groove array is carried out.The parameters of each evaluation index under different factors are obtained,and the variation rules of bottom surface roughness,edge damage and groove width of micro-groove arrays with the number of grooves are analyzed.The variation trends of surface roughness,edge damage and groove width with f eed rate,groove depth and spindle speed are studied.(4)The processing quality of monocrystalline silicon's micro-groove array is evaluated comprehensively through gray correlation analysis method,and the variation rules of the comprehensive evaluation value of processing quality with the spindle speed,feed rate and groove depth are obtained.The results show that the comprehensive evaluation model for micro-grinding quality of monocrystalline silicon's micro-groove array established in this paper is more comprehensive and reasonable than a single index in evaluating the processing quality of micro-groove array.This paper has a certain guiding significance to promote the optimization of micro-grinding process for micro-array structure.