| With the "2025 made in China" and "national informatization development strategy outline" two strategic objectives put forward,the state and the masses are demanding higher and higher rates of information transmission,while the volume of equipment is more and more small,the distance between the signal and the signal is smaller,so the crosstalk caused by the signal generated by the mutual coupling is more and more serious.The signal integrity problem is a key problem in the design of high speed backplane connector at present,and the decisive role of the high speed backplane connector's function.while the high speed backplane connector is the bridge signal transmission in the whole system,so the signal integrity problem of high speed backplane connectors in the signal system appears to be more important.Based on the theory of electromagnetic field,this thesis combines the actual product XHDU design.Starting with the footprint design of high speed backplane connector,the footprint design is optimized by electromagnetic energy coupling simulation.The material,shape,size tolerance and structural layout of the high speed backplane connector will affect the signal integrity of the products,thus causing the crosstalk and reflection out of the Specifications.In the design process,the conductive plastic and metal shield are effectively combined to reduce crosstalk while not causing signal attenuation.At the same time,for the products with low crosstalk and consistent impedance,this case adopt the unique 3D resonance damping shield technology and cleverly combined with the width of the terminal,plastic holes and unique design of conductive adhesive in the design process.In order to save the product development cycle and cost,through the three simulation,comparison and optimization,the optimal scheme is finally obtained.Finally,through the physical test,the performance of the product is consistent with the simulation data,and the product meets the design requirements. |
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