Analysis And Experimental Study On Temperature Field Of Magneto Rheological Fluid Testing Device

Magnetorheological fluid(MRF)is a new kind of intelligent material which can be controlled by magnetic field and stabilized suspension by mixing magnetic particles with magnetic property.Because of its excellent rheological properties,it has become an important branch of intelligent materials.The yield stress is the most important parameter to evaluate the rheological properties of magnetorheological fluids.The measurement of the yield stress of magnetorheological fluids is of great significance to the study of the rheological nature of magnetorheological fluids and to the application in engineering.The magnetic rheological fluid testing device of loading methods usually use electromagnetic coils,the electromagnetic coil produces a lot of heat when working,accurate,easy to affect the device so the study of the magneto rheological fluid testing device of temperature field is very important.Firstly,introducing the mechanism and properties of magnetorheological fluid and the material selection of device.Determining the evaluation standard of the test device.The magnetorheological fluid yield stress test device will generate three physical fields,such as electric field,magnetic field,and temperature field.The electric field,magnetic field and temperature field are interrelated and have some influence on the magnetorheological fluid yield stress testing device.Therefore,the heat transfer calculation of the magnetorheological fluid yield stress testing device should be calculated.On the basis of the theory of heat transfer,the comprehensive thermal conductivity of the enameled wire winding is analyzed.It lays the foundation for the simulation and test of the temperature field of the magnetorheological fluid yield stress test device.Then,according to the finite element temperature field simulation process,the system simulation analysis of the theoretical basis,including the control equation,the use of the turbulence model.Secondly,basing on the simulation process of finite element temperature field,the theoretical basis of the system is analyzed,including the control equation and the solution model.Useing Fluent to simulate the temperature field of the test device.It is considered that the integrated thermal conductivity of the enameled wire winding and the assembly gap of the test device have a great influence on the analysis of the temperature field.On the basis of the simulation model,the comprehensive thermal conductivity of the enameled wire winding and the assembly gap of the test device should be analyzed.Finally,the temperature field test platform of the test device is set up,and the temperature field test is carried out.The thermal conductivity of the coil winding in the test device is tested and verified.Using the test result of coil winding,the temperature field of the assembly gap of the test device is tested and analyzed,and the assembly gap is calculated.Combined with the simulation results,the temperature field of the whole test device is tested and analyzed.According to the design requirements of the testing device,the accuracy of the device is tested and analyzed on the basis of the temperature field.Finally,the temperature field of the test device is optimized.