Electrical Characteristics Of Flip-Chip Package Interconnection

With the rising of the national economy,the information security requirements increasingly tense,and the chip industry which is closely related to the information security has been an unprecedented concern.Chip industry localization trend has been irreversible.With the chip product size becoming smaller,frequency getting higher,and integration complexity becoming more complex,the impact of chip interconnect structures have not been neglected in the packaging integration technology.Therefore,the analysis of chip package signal integrity and electromagnetic characteristics became an important part of IC packaging design,especially in the radio frequency and high-speed electronic products.The research object of this paper was the typical flip chip package structure.Firstly,a high-frequency scalable equivalent circuit model of GS and GSG interconnection structures was established.The analytic formula of the model was proposed for its structural characteristics,and the parasitic parameters of the circuit analytical model were extracted.The scalability of the equivalent circuit model and the accuracy of the parametric analysis equation were verified by CST three-dimensional full-wave electromagnetic field simulation software and Advanced Design System software respectively.Secondly,this paper introduces the modeling principle and process of full-wave simulation software,and analyzes the signal integrity of the discontinuous bump caused by the flip-chip signal transmission from the aspects of geometric size and position layout.Then the paper studies several optimization design schemes and the experimental results show that the locally matching technology optimization effect is significant.At the same time,the crosstalk problem was analyzed and the structure of multilayer flip chip package was designed and optimized.Finally,the field distribution characteristics and transmission characteristics of the coplanar waveguide transmission line were studied.Based on the electric field radiation intensity,the electromagnetic radiation in the flip chip package was simulated and analyzed.The research on the electromagnetic characteristics of the flip chip package structure was mainly to construct the perfect model structure and the equivalent circuit analysis,which is the key link to solve the high-frequency encapsulation integration technology.This paper provides design ideas and parameters for chip packaging designers,and has broad market prospects and research value.