Design Of Reliability Screening Scheme For Electronic Components

This paper mainly focuses on the reliability screening of electronic components,analyses the screening items and screening stress of electronic components,introduces several commonly used screening items,and studies the design of typical screening schemes for semiconductors.In this paper,the reliability screening scheme design of electronic components is studied in detail,which has important theoretical significance and application value.The topic of this paper mainly comes from the frequent faults of the whole machine.The reliability of electronic components is discussed from the performance of the whole electronic system.For electronic components,the most effective way is to carry out reliability screening.The quality assurance of electronic components comes from reliability screening.Reliability screening is a non-destructive test for electronic components without defects and with good performance.It can induce the failure of electronic components with potential defects.The applied stress can activate potential defects and lead to the failure of electronic components,and then eliminate them,so as to improve the reliability of electronic components.The purpose of this paper is to study the unified screening process of each hospital under the premise of the existing screening criteria.The significance of this paper is to improve the reliability level of the batch of products.In a group of components,the defective components caused by potential adverse factors such as raw materials,equipment and technology and the like are eliminated,and the qualified components with certain characteristics are selected.A group of components can improve the reliability level of the batch due to the elimination of early-failure products by screening.In normal cases,the failure rate can be reduced by half to one order of magnitude,and the individual may even be reduced by two orders of magnitude.The practical value of this paper is to eliminate these defective devices before installation,so as to reduce the maintenance and downtime costs caused by on-site use.Early detection of failure devices is able to achieve greater economic and social benefits.The theoretical basis of the research work is based on the thorough study of "Microelectronic Device Test Method and Procedure","Semiconductor Separate Device Test Method" and "Electronic and Electrical Component Test Method".The typical test items in the conventional screening are studied,and the shortcomings of each item are identified.The analysis and determination of screening stress are also made.The research methods of this paper are as follows: through a large number of grounding tests and failure analysis of electronic components,we should combine failure analysis with screening.In order to determine whether the failure is caused by manufacturing defects or equipment failure or overstress in screening,failure mode should be determined and failure analysis should be carried out in screening.Mechanisms are then used to determine screening items and screening conditions.The main achievement of this paper is to develop two kinds of general screening process,design a typical model screening scheme,and study the supplementary screening of domestic devices.The screening procedure in practical operation of diodes is discussed.There are three kinds of customized screening flow.Different screening processes are carried out for devices of different quality grades.Only conformity checks are needed for high quality grade devices,and upgrade screening is needed for low quality grade devices.The higher the quality grade,the fewer screening items are.Screening scheme design is carried out for the triode 3DK35 E with CAST quality grade 2CK75 and G quality grade: screening items are determined by common failure modes of devices;screening stresses are determined by device manuals through many tests;screening time is determined by task type;the most representative parameters are selected for testing;data analysis and comparison of failure criteria are carried out after testing.To determine whether the parameters are out of tolerance and whether the function is invalid.Supplementary screening of domestic devices,according to the general screening process,determines the supplementary items and conditions on the basis of the manufacturer's first screening,and pays attention to the related tests of supplementary items when screening test items,so as to ensure the effectiveness of supplementary screening.At the same time,the screening scheme design of IGBT is studied,and the screening scheme design of the latest model is carried out.Final conclusion: Reliability screening is still necessary.Screening process customization requires clear screening items and screening conditions.At the same time,the applicability,validity and operability of screening items and conditions are ensured.In the design of reliability screening scheme,the applicability,validity and operability of screening items and screening stresses must be ensured.The feasibility of screening scheme should be evaluated by data analysis and failure criteria after test.Insufficiency of research work: When we carry out reliability screening,screening costs a lot of time and cost.According to the existing instruments and equipment,some failure modes can not be detected under non-destructive conditions,and it is difficult to eliminate them completely by conventional screening methods.Solution: More attention should be paid to the use of rapid screening to achieve the same purpose,which is our future concern.Screening is not omnipotent.For example,manufacturing defects need to be judged by destructive physical analysis to check the manufacturing process and quality of electronic components.It is an effective method to check manufacturing defects.