Research On Improvement Of Key Parts In Automatic Production Line Of PCB Vertical Wet Process Equipment

In recent years,with the improvement of science and technology,a variety of consumer electronic products are gradually to miniaturization,lightweight and multi-functional.The line diameter and line distance of printed circuit board are gradually to more dense.Most of the circuit board production must be relied to advanced equipment.It is important to improve the process quality and production efficiency of PCB manufacture by improving the existing equipment.In this paper,based on the existing vertical circuit board production equipment of the company,aiming at the problems of the key wet process equipment,combined with the current industry solutions.The suitable solutions for the company's equipment are proposed.The main research work is as follows.After the clamping device of worm gear and worm rod clamps the circuit board,the clamping forces acting on the circuit board surface are not uniform,which causes the deformation of the board surface.Combined with the theory of static analysis,Ansys static module is used to analyze the stress change and the deformation of the board at each clamping position.To simulate the spray effect of the circuit board in the etching section.The analysis shows that the surface deformation is serious.A pressure spring clamping device is designed and analyzed using the same boundary conditions.The analysis shows that the deformation of the board surface is reduced,which is beneficial to improve the process quality of the circuit board.During the production process,the process module will be heated and expanded,and the unloader machine will be pushed out to 25 mm.Combined with the theory of heat conduction,the Ansys steady state thermal module is used to analyze the thermal deformation of the sidewall of the module.Weld the reinforcement in the area where the side plate deformation is large.The improved module was simulated and analyzed to confirm the reduction of side plate deformation.By building the experimental module,the measured side plate deformation data were compared with the simulation analysis,and the surface deformation and numerical value were close to each other,and the side plate deformation was indeed reduced.This improvement helps to reduce sidewall deformation and the distance of the unloader machine being pushed out.The rotating mechanism on the unloader machine turns 90°,the suction mechanism has obvious vibration.Combining with dynamics principle,the Ansys dynamics module is used to analyze the displacement value of the point on the module bracket of suction mechanism farthest from the motor shaft in each time interval of turning.Compared with the theoretical displacement curve,the location of the module rigidity deficiency is found out.By increasing the contact area of the parts,the rigidity of the module is improved.The improvement is beneficial to improve the stability of the rotating action,and improve the yield of the circuit board.The thermal displacement of the module makes the transmission chain tense and the motor torque overload.A chain buffer mechanism is designed on the side of the passive chain wheel to reduce the tension.Through analysis and calculation,the motor can still work normally after the module moves 25 mm along the transmission direction.The Ansys static module is used to simulate and analyze the stress and displacement of each key part after the module displacement of 25 mm,so as to ensure that the part is within its allowable stress range.Chain buffer mechanism can effectively solve the problem of transmission motor overload caused by module displacement.By solving these problems,the deformation of PCB in process engineering can be reduced and the yield can be improved.Reduce the influence of thermal of process modules.Reduce the vibration of the suction mechanism.Improve the stability of the transmission.It is beneficial to improve the quality of the circuit board for vertical wet process equipment.