Research And Design Of Ultra-miniature Power Divider Based On Lumped Componets Of Thin Film Process

The power divider is widely used in microwave radio frequency systems,so the performance of the power divider has an important impact on the entire microwave telecommunication system.With the continuous development of 5G technology and Io T technology,microwave radio frequency systems are developing in the direction of integration.Therefore,the miniaturization of power dividers is of great significance for the integration of radio frequency systems.In addition,today's telecommunication system is developing in the direction of broadband,so the broadband design of passive devices is very necessary.This article is to study the power divider to achieve the miniaturization of power divider and the unification of broadband.The main research work is as follows:(1)In the circuit-level design of the broadband power divider,the bandwidth of the power divider is increased through multi-section technology.After verification,the performance of the two-section lumped parameter power divider cannot meet the requirements.Observe the performance diagram of the three-section power divider.By optimizing the parameters of the power divider,a three-section lumped parameter power divider with good performance is obtained.(2)The thin-film process is used for design.In the thin-film process,the capacitance is smaller than the inductor size and easy to realize.Therefore,when selecting a specific lumped structure,in order to reduce the size of the lumped parameter power divider,choose as much as possible.The low-pass ? model with a small number of inductors,and all branches using a low-pass ? model equivalent power divider have good performance.Through the choice of design circuit,the size of the power divider is further reduced.(3)In the modeling and design process of narrow-band unequal and wide-band lumped power dividers,in order to further simplify the circuit and achieve the purpose of reducing the size,part of the capacitors have been merged,thereby improving the power divider circuit.Reliability also reduces the size of the power divider chip.