| A lumped parameter thermal model for a multi-chip power module is presented based in the physical and geometrical characteristics of the module. The model is developed using the thermal component approach. The model is implemented in SABER and integrated with temperature dependent device models and other thermal component models to develop an electro-thermal model for a three-phase inverter. This report presents model development, implementation in SABER, simulation results, and calibration using experimental data. The model exhibit excellent matching of the temperature in the junction of the devices and good matching in the temperature in the heat sink which permits dynamic simulations of power electronic designs. |
