| As electronic assemblies exceed operating frequencies of 5 GHz, the need for a technique to characterize no-clean solder paste compatibility with RF circuit assemblies operating at these frequencies, requires the development of a test method that is not limited by lumped circuit parameter modelling. Furthermore, it demands a test method robust enough to discern differences between the effects of several residues and characterize their respective electrical properties.; This thesis presents a new method of characterizing the effect of no-clean solder paste residues on RF signals with the use of Ansoft HFSS electromagnetic simulations and insertion loss measurements. A microstrip T-Resonator was designed as the test vehicle with resonant frequencies near 5 and 10 GHz and a low-loss substrate (Rogers 4350). Insertion loss measurements were obtained for samples processed with five different no-clean solder paste formulations, both after processing, and after aging at 85°C and 85% RH for 14 days. |
