Computer-aided design optimization of airflow duct systems for cooling of electronic assemblies

With rapid developments in high speed, high-density electronics packaging, it is increasingly difficult to efficiently cool electronic components in order to guarantee reliable system operation.; This report presents a novel approach by integrating rapid prototyping and 3D scanning into the design optimization process. The process starts with an initial design of an airflow duct system based on preliminary CFD analyses. A model of this initial design is created through rapid prototyping. The prototype is then tested in a system mockup. Based on readouts collected during testing, the model is reshaped by directly cutting material away from the prototype or manually molding hardenable compound onto the prototype. When specific improvements have been confirmed through direct readouts, the revised model is scanned using a 3D scanner and merged with the initial CAD design. This improved design is then transported back to the CFD software for further analysis. The cycle can be iterated until all performance criteria are fulfilled. The proposed design methodology, consisting of CAD design, rapid prototyping, field testing, 3D scanning, and CFD analysis, has proved effective on a real world airflow duct cooling system. (Abstract shortened by UMI.)...