Fabrication And Performance Study Of Patterned Micro-structure Transducer

Nowadays,more and more devices are being miniaturized and integrated to meet the demands of application in modern society,leading an excellent performance and lower cost.For them,requiring temperature support,because of limited room due to miniaturized design,make it difficult to achieve the operating temperature.At present,micro hot-plate is primarily a miniature temperature supply device,with small volume,low power consumption characteristics,which employs a silicon process to produce a metal heat resistor on hundreds of microns silicon.However,the fabrication cost of silicon technology is high,and the micro hot-plate produced by silicon technology has some insurmountable shortcomings such as poor portability,poor stability and difficult packaging.This thesis is dedicated to looking for another solution that is low cost,strong portability,stability,reliability and easy encapsulation,which can provide temperature support for all kinds of devices requiring temperature supporting.Specifically,it mainly includes the following contents:Firstly,a three-layer composite micro hot-plate with dimensions of 1.3 mm×2.05mm×0.5 mm was designed,and copper heating resistance layer,intermediate adhesion layer and ceramic substrate as part of its body from top to bottom.The ceramic layer with low thermal conductivity makes the heat more accumulated and reduces the heat loss caused by conduction to a large extent.The appropriate resistance graphic design makes the heat distribution more uniform.The adhesive layer strengthens the combination ability of resistance and ceramic,making it have good stability and reliability.Then,the electro-thermal coupling model of the micro-hot plate was established by using the physical field interface provided by Comsol.Some factors affecting the thermal characteristics of the micro hot-plate were investigated,including the area of the micro hot-plate,the shape of the resistance,the width of the resistance,the thickness of the resistance and the resistance material.The simulation results show that the area has a great influence on the energy transfer efficiency of the micro hot-plate,and the smaller the area is,the higher the energy transfer efficiency is.The energy exchange efficiency of the micro hotplate with an area of 3 mm×3 mm is about 40 °C/W,and that of the micro hotplate with an area of 1.3 mm×2.05 mm is 134 °C/W,with the area reduced by 70% and the energy exchange efficiency increased by 235%.It is also found that the temperature increases by 1.5 °C～2.5 °C with the increase of resistance width by 1 μm.However,the thermal uniformity of the micro hot-plate decreases with the increase of resistance width.The degradation degree varies with the resistance distribution pattern,such as-0.18°C/μm for the double helix and-0.28 °C/μm for the Peano line.The resistance thickness affects the steady-state temperature and heating power of the micro hot-plate,and the temperature and power fitting data of the micro hot-plate with different thickness are linearly correlated.Finally,a series of key performance tests were carried out,including resistance consistency,resistance temperature coefficient,power consumption,temperature uniformity and thermal response time.The measured results are in line with expectations,indicating the correctness of the research method.