Preparation And Properties Of Transparent Conductive Silver Grid

With the development of organic electronic devices,the demand for transparent conductive films is increasing.At present,the traditional materials of transparent conductive films are mainly oxide semiconductors,including Tin-doped Indium Oxide.Indium is scarce,expensive.It is difficult to prepare.Researchers need to find a new alternative materials,metal grids stand out because of their good electrical conductivity and ductility among many materials.Theoretically,the metal mesh is used as a novel transparent conductive film because of its metal conductivity and mesh permeability,but it is dificult to prepare.This paper draws on the idea of lithography,using a linear channel type random crack template as a mask to combine a particle-free silver ink to prepare a metallic silver grid at a lower temperature.In this paper,the preparation methods of random crack grid template,particle-free silver ink and silver grid are explored and their performance is studied.In this paper,TiO2 sol is prepared by sol-gel method.Diethanolamine is used as a complexing agent.TiO2 sol is prepared with better stability.A random crack template can be successfully prepared by heat-treating at 150? via dropping.By controlling the amount of sol added,the crack width can be increased from 0.8 ?m to 2.11 ?m.The composition of the sol has a great influence on the width of the crack.By orthogonal experiments,it has been found that the variation of the amount of water can vary the crack width from 0.5 ?m to 1.7 ?m.The density of the crack can be adjusted by adding ethyl acetate.As the ethyl acetate is added,the cracking density is increased.The study of particle-free inks is mainly carried out from the preparation of different silver carboxylates and the ratio of the components of the ink.The decomposition temperature of silver carboxylate can be greatly reduced by the complexation reaction of silver carboxylate with 1,2-propylenediamine.Silver acetate ink,silver oxalate ink and silver tartarte ink are compared respectively.From the viewpoints of heat treatment temperature,film adhesion and conductivity,silver tartrate ink is finally selected as the ink of this study.For the selection of the components,a solvent with content of 1 mL and a molar ratio of silver amine of 1:4 are used as the final ratio to prepare a film having high density and good conductivity.The addition of ethylene glycol can reduce the occurrence of radial morphology of the film,and improve the density and conductivity.Finally,this experiment explores the preparation process of silver grid.The process parameters of spin coating is chosen.It is 100 rpm for 10 s,and 3000 rpm for 15 s.Using this process parameter and using a silver amine molar ratio of 1:4,the total amount of solvent is 1 mL.The film is prepared by using the process parameter,a silver amine molar ratio of 1:4 and and ethylene glycol is spin-coated as an additive with an amount of VEtOH:VEG=6:4.The random crack template was removed by ultrasonic vibration,and a silver grid with a high resistance of nearly 90%is finally prepared.A quality factor was introduced to evaluate the silver grid.The quality factor is increased by increasing the crack density and increasing the film thickness.It was confirmed that the increased thickness can significantly reduce the electric resistance even when the light transmittance is almost constant.