Manufacturing Process And Heat Transfer Performance Analysis Of Ultra Thin Stainless Steel Vapor Chamber

With the advent of the"5G era",the tendency of the electronic devices like mobile phone and computer to be compact,thinner and lighter is confronting a grevious issue of heat dissipation of even faster running chips than ever.In the design stage of mobile electronic equipment,the heat dissipation technology must be specially designed to reduce the temperature of the CPU.Vapor chamber have been widely used in 5G mobile phones to solve the problem of overheat.This paper explores a new preparing method and process for ultra-thin vapor chamber featuring thinner thickness,smaller volume,lower cost and shorter preparation cycle than the vapor chamber fabricated by other current industrial methods with a similar heat transfer performance.The main results of the thesis are as follows:1.Electrochemical deposition was explored to prepare wicks.15 wick samples were obtained by optimizing the process parameters.The surface morphology of the samples was studied by SEM.The porosity was measured and the influence of electrochemical process parameters on the performance of the wick was discussed.The recommended preparation parameters of the vapor chamber wick preparation are:the current density is 6A·dm^-2for 100s,followed by a 300s strengthening performance.2.On the basis of the aforementioned wick preparation,the manufacturing process of ultra-thin stainless steel vapor chamber and the corresponding heat transfer performance were studied.Experiments show that when the power of the heat source is small,the heat transfer performance of the vapor chamber with different filling rates changed little.When the power increased to 5W,the temperature differences between the hot and cold ends of the vapor chamber increases.When the filling rate is 90%,the maximum temperature difference was only 1.5?.3.The heat transfer performances of the vapor chambers prepared by the wicks of VC-1(6A·dm^-2)and VC-2(3A·dm^-2)were studied;The heat transfer performance of the vapor chamber of the liquid core was different.The research results show that the capillary structure performance of the wick has a great influence on the performance of the vapor chamber.The performance of VC-1 is the best at the preparing parameter of6A·dm^-2.The maximum heat dissipation power exceeds 5W,and the maximum heat dissipation power of VC-2 does not exceed 4W;The maximum temperature difference on the surface of the vapor chamber of the double-sided wick can be reduced to 0.3?,the temperature at the evaporation end will increase slightly,but not more than 2?.The heat transfer performance of VC-1 is similar to the heat transfer performance of copper vapor chambers manufactured by the industry,but the production cost is lower and it is expected to replace copper heat-dissipating plates.