Research And Improvement Of CeO₂ Slurry Suspension And Dispersion Performance

Although China is the main country that exports Ceria polishing powder production capacity,most of the high-performance Ceria slurry rely on imports.As the domestic demand for high-performance Ceria slurry continues to increase,it is increasingly important to carry out research on high-performance Ceria slurry.In this paper,the influence factors of the suspension and dispersion performance of the Ceria slurry and the process conditions of the slurry application were studied experimentally.The sedimentation behavior of the slurry,particle size,particle size distribution,absorbance,Zeta potential and microscopic morphology were studied.The effects of different surface active agent,pH,dispersion method,dispersion time,dispersion medium and other factors on the suspension performance of Ceria slurry were investigated.The ratio of the dispersant compound formula in the Ceria slurry was determined by orthogonal experiment.The response surface experiment method was used to give Ceria slurry suspension process conditions provide theoretical dosage.At the same time,how to solve the problem of the sedimentation layer at the bottom of the slurry was studied,the best formula composition and process conditions were determined.Finally,the slurry under the best conditions was used for polishing application research.The results showed that the compound formula of 0.4%sodium polyacrylate(PAAS),2.0%polyvinylpyrrolidone(PVP)and 1.5%magnesium aluminum silicate can effectively control the agglomeration of particles,so that the polishing liquid has a good suspension performance.The dispersion method using mechanical stirring and ultrasonic dispersion was more conducive to the dispersion of Ceria particles in the polishing liquid.When the pH value is 10,the pH regulator is NaOH,the dispersion time is 2.4 h,and the ethanol content in the dispersion medium is 16%,the optimal suspension conditions were obtained.The addition of 0.45%sodium carboxymethyl cellulose(CMC)can effectively alleviate the sedimentation at the bottom of the slurry,so that the slurry can be redistributed.The polishing rate of K9 glass was about 3.25 mg/min under the best conditions,which was higher than 2.86 mg/min in the initial polishing solution.After polishing,the surface roughness of the component was significantly reduced.The suspension and dispersion performance of the Ceria polishing solution was basically unchanged before and after polishing,and the surface of the component can be easily cleaned.