Study On Microstructure And Texture Of Ultra-high Purity Copper And Copper-aluminum Alloy For Sputtering Target

With the rapid development of integrated circuits,higher requirements are put forward on the microstructure and texture of ultra-high-purity copper and copper-aluminum alloy sputtering targets,and the effects of different rolling methods and annealing processes on ultra-high-purity copper and copper-aluminum alloys are studied.The influence of microstructure and texture helps to improve the quality of sputtering targets.Based on this,this paper systematically studied the microstructure changes of ultra-high-purity copper and copper-aluminum alloy sheets with different rolling methods and different deformations through metallographic microscopy,X-ray diffraction,electron backscatter diffraction and other techniques,and the changes after different annealing processes.The evolution of recrystallized structure and texture after different annealing processes,the following conclusions are drawn through research:(1)The ultra-high purity copper samples with 90% unidirectional rolling deformation and 90% cross-rolling deformation have obvious dynamic recrystallization at room temperature.The former also has serious abnormal growth of grains,and both will have Cube texture formation;In the two rolling methods,the Cu-0.1Al alloy sample with 90% deformation has a lamellar rolled structure along the rolling direction,and the Brass texture is more obvious.The ultra-high purity copper with 54%,70% and90% unidirectional rolling deformations began to form recrystallized grains after holding at 100°C for 1 hour.The amount of deformation increased,the sample had more recrystallized grains,and the degree of recrystallization was higher;holding at 200?for 1h,with the increase of deformation,the average grain size of the sample becomed smaller,and the content of special grain boundaries increased;holding at 300? for 1h,as the deformation increases,the grains were more prone to abnormal growth.(2)The Cu-0.1Al alloys with 54%,70% and 90% unidirectional rolling deformations still maintained the rolled structure after being held at 100°C for 1 hour.The recrystallization temperature of Cu-0.1Al alloy was higher than ultra-high purity copper: holding at 200? for 1h,with the increase of deformation,the degree of recrystallization of the sample increased;holding at 300°C for 1 hour,the Cu-0.1Al alloy was in a completely recrystallized state.As the amount of deformation increases,the grain size of the sample becomed smaller.The ultra-high purity copper and Cu-0.1Al alloy with 54%,70% and 90% cross-rolling deformation are kept at 300? for1 h,as the amount of deformation increasing,the average grain size decreased,and the content of special grain boundaries increased,The equiaxiality of the crystal grains was improved,and the orientation density value of the texture was reduced.Compared with unidirectional rolling,the deformation method of cross rolling was more conducive to eliminating anisotropy and generating random texture.(3)In the isothermal annealing experiment at 200? for the ultra-high purity copper with 70% cross-rolling deformation,different time had little effect on the average grain size,content of special grain boundaries,and grain orientation,but holding for 2 hours was more conducive to eliminating anisotropy of the sample and forming a weak texture state.In the isothermal annealing experiment at 450? for the Cu-0.1Al alloy with 70% cross-rolling deformation,different time had a greater influence on the average grain size and the content of special grain boundaries.The average grain size is the smallest when holding for 15 minutes,which is less than 30?m,but it is more important when holding for 1 hour,because it was helpful to eliminate the anisotropy of the sample and form a weak texture state.