Study On Preparation And Performance Of Integrated Environmental Response Device Based On Sn-3.5Ag Alloy Film

Due to its low melting point,the fusible alloy is widely used in metal phase change materials,solders in electronic packaging,die stamping dies,and thermal components such as fuses and fuses in electrical appliances,electronic equipment,fire fighting and fire alarm equipment.Magnetron sputtering technology is widely used in industrial production because of its low deposition temperature,deposition speed and other advantages.In this paper,Sn-3.5Ag eutectic thin films were prepared by RF magnetron sputtering method.Based on this thin film,the eutectic thin films were prepared for an integrated environmental response device.The microstructure and properties of Sn-3.5Ag eutectic thin films were studied by XRD,SEM,EDS,DSC and HMS-TT Hall effect testing methods.The effects of sputtering pressure,sputtering power and sputtering time on the surface morphology,microstructure and properties of Sn-3.5Ag eutectic thin films were investigated.The temperature response test platform was built to test the response temperature of the integrated environmental response device,and the influence of different process parameters on the response temperature of the integrated environmental response device was analyzed.The following conclusions are drawn:Sn-3.5Ag eutectic thin film:it is composed of irregular island-like layered particles with size of 0.5?2?m when the sputtering pressure is less than 0.5 Pa.With the increase of sputtering pressure,the film gradually changes into spherical particles consisting of 10?100 nm.The thickness of the film increases first and then decreases,and the deposition rate increases first and then decreases.The increase of sputtering power can increase the particle size and improve the surface compactness of the films.With the increase of sputtering time,the film thickness increases linearly,the grain size increases slightly,but the film densification decreases.When the sputtering pressure is 0.5 Pa and the sputtering power is 108 W,the film with the highest density and the best deposition efficiency(21.7nm/min)can be obtained.The electrical conductivity of Sn-3.5Ag eutectic thin film:The resistivity test results show that the film resistivity decreases first and then increases with the increase of sputtering pressure,decreases with the increase of sputtering power,and slightly increases with the increase of sputtering time.The film resistivity is mainly affected by the particle size,density and thickness of the film.The smaller the particle size of the film,the higher the interface between particles and the higher the resistivity.The film density decreases and the resistivity increases.The film thickness decreases and the resistivity increases.When the sputtering pressure is 0.5 Pa,sputtering power is 108 W resistivity lowest 15.4??�cm closest to the bulk metal.According to EDS,XRD and DSC analysis,the distribution of Sn and Ag elements in the films prepared by magnetron sputtering is uniform,and there is a small amount of Ag₃Sn phase in the films.The film melting temperature is 220?,which is close to the eutectic temperature of Sn-3.5Ag.The integrated environmental response structure was prepared by curing with high temperature silver conductive adhesive.The maximum tensile load of the structure was 16.18 N.The impact response process of the structure with load bearing based on 150 MPa glass substrate was consistent,and the mechanical response function under the acceleration of 8000?10000 g could be realized.The temperature response measurement results show that:Flux is the key to the temperature response test conditions,it can effectively improve the metal surface oxidation state,increase the role of the molten metal liquidity,promote the moment when the metal melting polycondensation temperature test to complete response,and only when the amount of flux is more than 10?L can reach the effect of thin film is completely condensed into metal balls.When the sputtering pressure is less than 0.5 Pa,the sample can respond accurately at the eutectic temperature,while when the sputtering pressure is greater than 2.0 Pa,the melting point of the nanoparticles is lower than that of the bulk samples due to the size effect,and the sample will respond earlier than the eutectic temperature.When the sputtering power is 108 W and 144 W,the sample can respond accurately at eutectic temperature.The sputtering time has no significant effect on the response temperature.