| Sn–Pb solder has been widely used in electronic equipment due to its good wettability and low price.Because of the toxicity of lead and its compounds,it can lead to health problems in humans.Many countries have legislation on lead-free electronic products to protect the ecological environment.Over the past few decades,a variety of Sn-based lead–free solders has been developed successfully.It mainly includes Sn–Ag–Cu,Sn–Zn,Sn–Ag,Sn–Cu,Sn–Bi.The eutectic Sn-58Bi alloy has a melting point of139??.It is very popular due to the low melting temperature and good wettability.Nanoparticle strengthening and micro-alloying were used to improve the properties of lead–free solder.The microstructure,wettability,melting characteristics,hardness and corrosion resistance were studied.Sn–58Bi–x Ti3Al C2(x=0,0.01,0.02,0.05 and 0.10 wt.%)composite solder were prepared.Microstructure,melting properties,wetting properties and hardness of composite solder were investigated.The results showed that Ti3Al C2 plays the role of fine crystal reinforcement.With the addition of Ti3Al C2 of 1.0 wt.%,the wetting angle was reduced by 13.3%.The onset temperature of the composite solder was between137.7?and 138.5?.The peak temperature is between 147.1?and 160.8?.In general,the melting point of the composite solder remained stable.The hardness of the composite solder was positively correlated with the addition of Ti3Al C2.With the addition of Ti3Al C2 of 1.0 wt.%,the hardness increased by 13.5%.Besides,the effect of Ti3Al C2 on the growth behavior of intermetallic compounds(IMC)was explored.The growth of intermetallic compounds was inhibited.Sn–58Bi–1.0Fe solder alloy was prepared to study the effect of Fe particles on the corrosion resistance of Sn–58Bi.The corrosion process of solder in marine atmospheric environment was stimulated by dry/wet cycle corrosion test(CCT).The corrosion current density(icorr)of Sn–58Bi–1.0Fe solder alloy decreased by 11.5%under the relative humidity(RH)of 85%.The result showed that the presence of FeSn2intermetallic compounds could suppress the corrosion process.The corrosion product was tin oxide chloride hydroxide.The Sn-rich phases layer structure was formed on the Sn–58Bi solder surface after the electrochemical test.Obvious pitting corrosion can be observed on the Sn–58Bi–1.0Fe solder surface.The empirical findings in this study provided a new understanding of the corrosion mechanism of Sn58Bi solder.The issue of corrosion evolution behavior is an intriguing one that could be usefully explored in further research. |
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