Research On Key Technologies And Equipment Development Of Flexible Hybrid Electronics Integranted Fabrication Based On Multi-material 3D Printing

Flexible hybrid electronics is a new type of flexible electronics that has emerged with the development of flexible electronics,flexible hybrid electronics integrates prefabricated rigid or flexible functional materials/components of traditional electronic structures on flexible substrates,resulting in flexibility that cannot be achieved by traditional rigid wafer devices,the system has been widely used in the fields of biomedicine,wearable devices,printed radio frequency antennas,and software robots.However,at present,fabrication of many flexible hybrid electronics requires a combination of multiple processes and multiple equipment,the automation level of most equipment needs to be improved,the high efficiency,low cost,high level of automation,rapid fabrication and multi-layer circuit structure fabrication of flexible hybrid electronics is still a challenge.In view of the current difficulties faced by flexible hybrid electronics fabrication technologies,this paper proposes a new method for flexible hybrid electronics integrated fabrication based on multi-material 3D printing.The fabrication method is mainly carried out from four aspects: basic principles,equipment development,experimental research,and typical case studies.A detailed study has verified the feasibility and universality of the proposed fabrication method.The main work of the research is as follows:(1)A new method for flexible hybrid electronics integrated fabrication based on multi-material 3D printing is proposed,the combination of multi-nozzle and vacuum suction and release device can realize the rapid production of flexible hybrid electronic integration based on multi-material 3D printing and automatic device suction and placement,the basic structure and related functions of the 3D printing system are explained.The structure and fabrication processes of flexible hybrid electronics with single-layer and multi-layer circuit structures are described in detail.(2)In view of the difficulty of the current fabrication equipment to realize the rapid fabrication of flexible hybrid electronic integration,combined with the basic structure and specific functions of the proposed 3D printing system,design the mechanical structure and control system of the equipment for flexible hybrid electronics integrated fabrication based on multi-material 3D printing,select,assemble and debug related parts,introduce each component in detail the specific parameter information of the components,and finally completed the development of the equipment for flexible hybrid electronics integrated fabrication based on multi-material 3D printing,it provides a new fabrication equipment for flexible hybrid electronic integrated rapid fabrication.(3)Aiming at the process flow of the proposed fabrication method,conduct experimental research on the fabrication of the substrate layer,wire,functional structure layer,and packaging layer,obtain the influence and law of each process parameters(printing air pressure,printing speed,curing temperature,relative printing height,etc.)on the flexible hybrid electronics fabrication process and results;the pick and placement process of functional devices is explained in detail.(4)Through the method of flexible hybrid electronics integrated fabrication based on multi-material 3D printing,single-layer circuit structure flexible hybrid electronic—flexible pressure sensor,multi-layer circuit structure flexible hybrid electronic—flexible double-layer series circuit,flexible electronic without functional structure—flexible ectromagnetic actuators,the fabrication of 3 typical cases has achieved,and carried out related tests,the theoretical correctness of the flexible hybrid electronics integrated fabrication based on multi-material 3D printing and the effectiveness of actual fabrication have proved.It proves that for flexible hybrid electronics or flexible electronics without functional devices,flexible or rigid functional devices,single-layer or multi-layer circuit structures,Si C/PDMS or PDMS functional structure materials,etc.,the flexible hybrid electronics integrated fabrication based on multi-material 3D printing can achieve the stable fabrication of different situations and has better adaptability.The method of flexible hybrid electronics integrated fabrication based on multi-material 3D printing proposed and the fabrication equipment developed in this study can achieve high automation,high efficiency,low cost,flexible hybrid electronics integrated rapid fabrication,and a breakthrough in the current flexible hybrid electronics fabrication methods that it is difficult to fabrication a multi-layer circuit structure.The fabrication method provides a new solution for the rapid fabrication of flexible hybrid electronics producting.