Study On Localized Electrodeposition Additive Manufacturing Of Copper Metal Microstructure Based On Micro Anode

Additive manufacturing technology is widely used in the metal processing and forming due to its obvious technical advantages.However,the precision rapid prototyping of micro-scale 3D metal parts is still a difficulty.Electrodeposition additive manufacturing forms the target structure through the reduction of metal ions,which has obvious advantages in the molding of micro-scale parts.Localized electrodeposition additive manufacturing technology has high degree of freedom and flexibility.It is one of the most potential technologies in the field of electrodeposition additive manufacturing.On the basis of building the localized electrodeposition additive manufacturing system platform,this paper systematically studies the influencing factors and parameter settings in the experiment,explores the forming mechanism of 3D structure,and realizes the localized electrodeposition additive manufacturing of micro-scale metal parts.The details are as follows:1.Understand the basic theory of electrochemistry and the basic principle of localized electrodeposition additive manufacturing.On this basis,the system platform is built and the initial parameters are determined.According to the accuracy requirements,the electric displacement table is purchased and matched with the control cabinet,power supply and damping vibration isolation table to form the core device of the experiment.At the same time,the micro-anode is encapsulated and the cathode substrate is prepared.Together with the experimental device,the localized electrodeposition additive manufacturing system platform is formed.Through preliminary experiments,the inter-electrode gap of 50?m and the voltage amplitude of 2.8V-3.2V are selected as the initial parameters of subsequent experiments.2.The influencing factors of localized electrodeposition additive manufacturing are studied,and reasonable experimental conditions are determined.The voltage and concentrated sulfuric acid will directly affect the deposition rate,and then affects the morphology quality of the deposited structure.The components of 150g/L Cu SO₄·5H₂O,0.6mol/L concentrated sulfuric acid and 3.0V voltage are selected for subsequent experiments.The inhibition effect of polyethylene glycol(PEG)significantly improves the morphology quality and the deposition rate decreases only slightly,if pulse voltage is applied,the defects will be further reduced,but the deposition rate will be greatly decreased.Considering the morphology and rate comprehensively,200mg/L PEG is added under the above conditions as the basic experimental conditions of subsequent experiments.3.The forming mechanism of localized electrodeposition additive manufacturing3D structures is studied,and the additive manufacturing of 3D parts is realized.Firstly,the printing mode of feedback movement is determined.On this basis,the deposition of no overhang structure is carried out first.According to the electric field distribution,a horizontal movement interval of 80?m is adopted,and the printing method for printing defects is improved.Due to the limitation of electric field distribution,90°overhangs are difficult to form rapidly,but overhangs less than 90°within an angle can be manufactured successfully.Copper-nickel bimetal deposition experiment is carried out,which provides the possibility for the manufacture of overhang structures greater than 90°.On this basis,complex 3D parts are fabricated.4.The applications of localized electrodeposition additive manufacturing of 3D micro-structures are studied,including flexible electrodes,micro-electrode arrays,and hydrophobic structures surface.Due to the weak bonding force between the ITO conductive glass and the deposition structure,a simple flexible electrode is prepared by using the substrate combined with PDMS.In the preparation of micro-electrode arrays,the minimum interval of 190?m is determined,and micro-electrode arrays are prepared by using single-electrode and double-electrode micro-anode respectively.Finally,a hydrophobic surface is prepared based on the same micro-copper column arrays,and its hydrophobicity is further improved after modification.