Research On The Preparation Of Three-dimensional Ceramic Substrate By Inorganic Adhesive Bonding

Due to the high thermal conductivity,outstanding thermostability,and excellent corrosion resistance,ceramic substrate has been widely applied in electronic packaging,especially in high-power device.In order to realize hermetic package,some photoelectric devices should be packaged by three-dimensional(3D)ceramic substrates,which containing planar ceramic substrates and dams on the planar ceramic substrates to prevent the erosion from oxygen,moisture and dust.Most of the existing 3D ceramic substrate preparation technologies are difficult to meet the packaging requirements due to poor pattern precision,low preparation efficiency,and high cost.In order to obtain the 3D ceramic substrate with high pattern precision and vertically interconnected,this dissertation was based on DPC ceramic substrate and fabricated 3D ceramic substrates by bonding the through-hole dam plate to the surface of the DPC substrate using Inorganic Adhesive.The main contents are described as follows:(1)Structural design and material selection of 3D ceramic substrates.We first designed the structure of the 3D ceramic substrate.Then,according to the requirements of graphics accuracy,thermal conductivity and heat resistance,we choose DPC substrate as the planar substrate.According to the requirements of structural strength and tightness,inorganic materials such as metal aluminum,copper and alumina ceramics are selected as the dam material.Three adhesives are chosen as bonding materials according to the bonding strength requirements between different materials.(2)Research on Adhesive Coating Technology and Alignment Technology for Plate-to-Plate Adhesive.In view of the problems of the Plate-to-Plate bonding process,the injection method was proposed on the basis of the squeegee method to coat the adhesive,and related molds were prepared.The experimental results show that the injection method can better control the position distribution of the adhesive,and the dam plate and the DPC substrate can be aligned with high precision through the manufactured alignment plate.Finally,the preparation of 3D ceramic substrates is realized by Plate-to-Plate bonding.(3)Performance test and analysis of three-dimensional ceramic substrate.Considering the DUV-LED packaging process,clear technical requirements are put forward for the performance of the 3D ceramic substrate.The performance of the 3D ceramic substrate was tested and analyzed in terms of substrate morphology,shear strength,air tightness and reliability.Finally,a way to optimize the performance of three-dimensional ceramic substrates is proposed.