Preparation Of Epoxy Resin Adhesive Modified By Silane Coupling Agent

With the rapid development of mechanization and automation of production in all walks of life,digital inkjet printing technology significantly changes the mode of traditional textile printing in the production of print fabrics.Digital inkjet printing,also known as inkjet printing,has outstanding advantages with precise accuracy and delivering the correct amount of dyes;it achieves energy-saving and cost-effective printing.It has occupied the vast market in developed countries such as Europe and the United States,owning the core technology.In recent years,inkjet printing technology patent filings have increased in domestic patents rapidly.The inkjet printing technical progress is being localized gradually,including the vital manufacturing technology of Micro Piezo print head.The microscopic piezoelectric elements（like crystals and ceramics）are adhered to the actuator by adhesive built behind the print nozzles.The adhesive had chemical resistance when the nozzle was applied in textile printing production with inks or colour pastes.Therefore,the preparation of solvent resistance adhesives to achieve firmly stick and not be weakened by inks/colour pastes has become the essential part of the research in manufacturing print nozzle.As a commonly used organic polymer material,epoxy resin has outstanding physical and mechanical properties,adhesion,and low pollution in various fields.The preparation of epoxy resin binder by silane coupling agent modification has been widely used and studied.This paper used epoxy resin E-51 with low cost,good fluidity,and high viscosity as the main component.Three silane coupling agents,GY-1,GY-2 and GY-3,were selected to modify it.DMF was used as a diluent,dicyandiamide was used as a curing agent,and 2-methyl imidazole was used as an accelerator to prepare an epoxy resin adhesive for the voltage printing nozzle.The adhesion between the ceramic gasket and electrode element in the printing nozzle was simulated using the pre-treated PI film and glass slide as the substrate in the laboratory.The adhesive properties such as system viscosity,gelation time,curing temperature,peel strength,and solvent resistance were tested and evaluated.The experiment showed that the adhesion of the adhesive increased first and then decreased with the increase of silane coupling agent dosage.In the E-51 system,the silane coupling agent had the best effect when the dosage was between 11%and 13%.Finally,the formulation of laboratory adhesive NGY-1 was determined as follows:E-51 was used as matrix,12%GY-1,3%dicyandiamide,10%DMF and 0.4%2-methylimidazole（the mass percentage concentration of the total system）were added.The maximum peeling strength reached 656.96 N/m,and the curing temperature was between 97.78℃ and 172.40℃.The apparent activation energy Ea _NGY-1 was calculated by Kissinger method as 58.95 J/mol.The peeling strength was retained by more than 80%after soaking in dimethyl ether and dimethyl propylene glycol for three months.This paper evaluated and tested the various properties of commercial adhesive AB-1.The initial viscosity was 0.2710 Pa·s,the maximum peeling strength was 741.09 N/m,the curing temperature was between 63℃ and 136℃,and the apparent activation energy Ea_AB-1was 56.37 J/mol.The peeling strength was below 50%after soaking in diethyl glycol methyl ether,propylene glycol methyl ether and diethyl glycol diethyl ether.The silane coupling agent was modified on the adhesive AB-1,and the possibility of optimizing the adhesive formula was explored compared with the homemade adhesive NGY-1.