Study On Heat Dissipation Performance Of Dual-chip Piezoelectric Fan

With the rapid development of today’s technology,a variety of different electronic products continue to appear,and these electronic products are developing with high integration,high performance,and miniaturization,making the number of devices that can be accommodated in the same space More and more,the heat flow density in a narrow space is getting higher and higher,which will cause the entire electronic component to generate more heat.More heat may cause the entire electronic device to be damaged,so it is necessary to conduct reasonable heat dissipation to control the temperature at within a reasonable range is especially important.Piezo fans have the advantages of simple structure,low noise,etc.,and have great application prospects in heat dissipation of integrated small electronic components.This article focuses on the dual-chip piezoelectric fan,and analyzes the heat dissipation performance of the system composed of the dual-chip piezoelectric fan through a combination of theory,simulation and experiment.The main research contents are as follows:First,the theoretical mathematical model of the dual-chip piezoelectric fan is established,and the vibration response equation is derived;Through the piezoelectric coupling and dynamic analysis of ANSYS,the natural frequency and mode function of the fan are simulated;The corresponding experimental platform is set up,and the vibration response parameters of the fan are analyzed by comparing experiments,theories and simulations;The vibration performance of the single and double chip piezoelectric fans is compared,and the vibration displacement of the double chip is about 3/2 times that of the single chip.Secondly,the geometrical factors of the dual-chip piezoelectric fan and the arrangement and combination of the dual-chip piezoelectric fans are analyzed;Through the dynamic grid technology in FLUENT,the influence of the distance between the fan and the heat source on the heat dissipation performance of the dual-chip piezoelectric fan is analyzed,and a simplified wind speed equivalent model is proposed to verify its rationality;The corresponding experimental platform is built,and the heat dissipation performance of the fan is verified by comparison with simulation.The heat dissipation performance of the single and double chip piezoelectric fans is compared,and the heat transfer coefficient of the dualchip piezoelectric fan is about 4/3 times that of the single chip.Finally,the dual chip piezoelectric fan is combined with different heat sinks,and two new types of heat sink structures are proposed according to the characteristics of the fan.Through FLUENT software,the structural form with superior heat dissipation performance was analyzed in comparison with the traditional form heat sinks.It was found that the new type heat sink II was about 4℃ lower than the straight rib heat sink.At the same time,combined with the field synergy theory,the coordinated angular distribution in different forms was obtained.And field coordination angle of the pin rib heat sink is small;The corresponding experimental platform was set up and the experimental verification was carried out.