Design And Optimization Of Polishing Device Based On Planetary Motion

With the support of national science and technology major project,aiming at the development of robot NC polishing equipment for large aperture aspheric optical lens,this paper systematically studies the fixed-point removal function of polishing device in planetary motion mode,dynamic balance analysis of robot polishing system and static state of polishing device,based on the removal principle,combined with modern design technology such as topology optimization and sensitivity analysis Dynamic analysis and lightweight design.This research provides reference and theoretical basis for the design and optimization of polishing device and has important practical application value.The research contents and achievements are summarized as follows:Firstly,based on the analysis of the fixed-point removal function of the polishing device under the planetary motion mode,the approach factor is used as the evaluation standard of the removal function,and the eccentricity,planetary motion in the same and opposite directions are compared as the design parameters to simulate and analyze the fixed-point removal amount in the polishing area when the disc is rotated for one revolution.According to the two factors and four levels orthogonal test for eccentricity and planetary motion speed ratio,the most suitable combination of parameters is found,which can guide the design of polishing device.Secondly,the structure of the polishing device is designed after the technical parameters were defined,and some hardware of the robot polishing system is introduced.Based on the vibration analysis of the 6-DOF Hybrid Polishing Robot and the polishing device,the four,five and six axis coordinate system of the robot is established,and the layout scheme of the polishing system is studied.At the same time,through the dynamic analysis and dynamic balance theory,combined the torsional stiffness of four or six axes of the hybrid robot,the specific parameters of the balance weight are obtained,and the correctness of the dynamic balance analysis is verified by the simulation of Solid Works motion software.Thirdly,through the static analysis of ANSYS software,it is found that the lightweight design links and weak stiffness links in the polishing device;through the harmonic response analysis,it is proved that the polishing device has a higher fundamental frequency and there is no resonance risk under the exciting force frequency.The structural optimization design is carried out according to the analysis results.Specifically,through the Hyper Mesh software,the flange of the polishing device is designed to be light-weight,and the topological optimization objective of constant stiffness is realized under the condition of minimum mass.For the weak part of the stiffness,through the sensitivity analysis of the design variables,the thickness dimension that has the greatest impact on the stiffness is found,and the optimization is carried out in combination with the actual working conditions.Finally,the optimization design of the whole structure of the polishing device is realized.Finally,the actual processing experiment is carried out on the workpiece.The removal profile on the fixed point of the workpiece is measured by the Nanovea white light interference three-dimensional profilometer.It is verified that the actual processing removal function is indeed Gauss type.The design of the polishing device meets the processing requirements and can achieve the rapid convergence of the surface profile.