Research And Development Of Automotive Electronics Wafer-to-Chip Testing Framework

With the continuous development of social economy and the continuous improvement of people’s living standards and quality,the penetration rate of automobiles in domestic households has increased year by year.As an important automotive electronic component in the development trend,automotive camera chips are becoming more and more important in the field of automotive electronics,and the amount of on-board cameras in each car is also increasing year by year.Each car camera chip must go through a rigorous testing program before being sold to ensure the high reliability,safety,and timeliness of the chip.This article is based on the vehicle camera chip FH8310 to develop a test plan.FH8310 is a high cost-effective image signal processing chip for parallel interface CMOS image sensors,which supports 1Mega/1.3Mega pixel RGB bayer or RGB-IR CMOS image sensors,for vehicle camera applications.Advanced 3D noise reduction processing technology,support fisheye function,support 720 P analog high-definition output.Developed a test plan for chips from CP(Chip Prober)to FT(Final Test).The goal of this article is to design the test environment for the car camera chip and develop the CP and FT test procedures.After the development is completed,the chip will be put into the mass production stage of millions of levels.The main content is the development and debugging of the CP test program,the development of a car regulation program to process the data generated by the CP test,and the processed data to the next process package.After the package,the development and debugging of the FT test program needs to be developed.This article writes a CP data processing optimization program,discards the chips with potential failure risks before packaging,designs the CP and FT test environment based on the J750 HD test machine,and develops the FH8310 chip to achieve a digital function test of 20 Mhz on the J750 HD,with a sampling rate of 1Mhz ADC,DAC test program.