Analysis On Copper Sheet Embossing Plastic Experimental

With the increasing number of the demand of the electrolytic copper,so many factors may limit the development of electrolytic copper production such as the shortage of resources,or the environmental destruction.And its production efficiency is always the key point of the research,also the plastic efficiency of copper plate is one of the major difficulties of the enterprises’ confusion at present.Under the current technological conditions,material particularity of copper sheet makes it only can use artificial method in the form of plastic processing.More and more factors become the bottleneck of enterprise development such as high labor intensity low efficiency of the workers and high labor costs.According to the practical problems,from the following several aspects:In this paper,a preliminary scheme which named narrow type embossing plastic package was raised that under the particularity of copper sheet and processing difficulties.Using Deform to simulate the process,and the analysis of the roll gap for the influence on the effect of stress and strain,and plastic are based on the variable thickness of copper plate virtual model.At the same time,in order to validate the simulation accuracy,the physical prototype that was manufactured.Combined with the advantages and disadvantages of the first kind of scheme,the second scheme was put forward which named wide type embossing plastic package.The articles using deform to analysis the impact of the roller clearance for stress,strain and trailer degrees.At the same time,in order to validate the simulation accuracy,the physical prototype that was manufactured.On the basis of the optimal parameters of the simulation,the articles select the parameters interval to be analyzed.Analysis of wide type embossing process type is better than that of narrow embossing process.