Structural Optimization And Simulation Analysis Of New Plate-fin Heatsink

In today’s digital age,electronic devices are becoming more compact,multifunctional,and high-performance,and the modern devices generate more heat than in the past.In order to ensure the performance of the devices and the safety of users,this requires a higher heat dissipation performance of the device,efficient heat dissipation technology is urgently needed to ensure long-term stable operation of various electronic devices,reliable and low-cost cooling methods are not available,and effective thermal management becomes more and more important.This paper uses ANSYS Icepak software to perform simulation calculations,optimizes the structure of the plate-fin heatsink,reduces the problem of uneven temperature distribution on the heatsink,improves natural convection heat transfer and saves production costs.The main contents of this article are summarized as follows:1)Briefly introduced some basic concepts and development status related to heatsink,and analyzed some difficulties faced in the current development process.Secondly,the research method of heat dissipation simulation design is introduced,and some basic overviews are made on the theoretical basis of thermal simulation and the CFD simulation software ANSYS Icepak used in this article.2)A new type of fin-connected heatsink with a heat conducting rod is proposed,which can improve natural convection heat transfer.Compared with the conventional plate-fin heatsink,the total heat transfer coefficient of the new type heatsink with heat conducting rods is increased by about 10%,which is mainly due to the larger fin contact surface area and better heat transfer efficiency.In addition,because this design can also have a 9%thermal performance improvement with a case,it can be applied to some small sealed electronic devices.3)A new type of heatsink with windmill-fin structure is proposed.The changes in the flow field and temperature field under different fin thicknesses,fin arrangements and fin numbers are calculated,and the effects of different parameters are analyzed.The simulation results show that the windmill-fins can improve the air flow in all directions on the heatsink and alleviate the problem of uneven temperature on the substrate.The final structure can improve the heat dissipation performance and greatly reduce the material consumption of the heatsink.It can effectively reduce the production cost,and the structure design is simple and practical.It provides an economical and practical alternative for the widely used plate-fin heatsink,and has a great application prospect in the field of electronic component heat dissipation.