| At present,the demands for lighting equipment develop towards the trends of high power and small size.These development trends put forward higher requirements for the design parameters,service life,work performance and safety of high-power LED lamps.In this study,the cases of heat dissipation,auxiliary heat dissipation and lamp layouts are simulated.The temperature distribution got from the simulation in this study can provide a reference for optimization of high-power LED lamps,which can improve the service life of LED.The 3-D model of high-power LED lamp is established.The main work and innovations are as follows.(1)The heat dissipation of LED lighting can reduce the temperature.The 3 heat dissipation modes of single fin radiator,auxiliary heat dissipation of heat dissipation fan and heat dissipation fan/inorganic superconducting heat pipe are studied through simulation.The results demonstrate the heat dissipation fan/inorganic superconducting heat pipe has the most obvious effect,which can reduce the maximum temperature of single fin radiator from 73.496℃,77.202 ℃ and 80.904℃to 47.162℃,44.253℃ and 38.881℃.The heat dissipation temperature difference is as high as 41℃.(2)3 different high-power LED bulb layout schemes are simulated and studied.The influence trend of bulb layout thermal resistance of high-power LED lamp on temperature is obtained.The area of the highest temperature area corresponding to 3schemes is significantly different.The smaller the power of the outer LED bulb.The internal resistance is the smallest when the difference between the inside and outside of the LED bulb is small.The high-temperature area is the smallest.The overall distribution trend of the simulation results of 3 schemes when the ambient temperature is 22℃ tends to be consistent.The maximum heat flow appears at the edge of the heat exchanger.The simulation results of 3 schemes show that the change of thermal resistance affects the change of local high-temperature area which has little effect on the overall heat dissipation.(3)The fin thickness,fin height and fin number as the reference series and the junction temperature as the evaluation index are set.The correlation sequence is obtained.The number of the influence on the junction temperature is the fin thickness,fin number and fin height.The junction temperature,maximum junction temperature and average junction temperature difference and radiator weight are set as evaluation indexes.The correlation degree between the radiator performance of each group of experiments and the performance of the ideal radiator is solved by grey correlation analysis method.The correlation degrees are sorted.It is found that scheme 9 has the greatest comprehensive correlation with the ideal radiator in terms of heat dissipation and cost.The scheme 9 is the selected optimal radiator fin scheme. |