Fluid-Solid Coupling Simulation Analysis And Experimental Study On A New Piezoelectric Synthetic Jet Pump

With the gradual evolution of electronic equipment to a high degree of integration,miniaturization and functionalization,its internal heat is concentrates constantly and the density of heat flow is continuously building up,which tends to result in thermal failure of electronic equipment.In order to guarantee the reliability and stability of electronic devices,there is an urgent need to develop new and efficient heat dissipation technologies.In this paper,a brand new small-size piezoelectric air pump with a nozzlediffuser designed for the inlet channel is developed innovatively based on a conventional synthetic jet piezoelectric air pump.In addition,the correctness of the design principle of the air pump developed in this paper is verified by the synthetic jet phenomenon of the flow field distribution inside the piezoelectric pump under resonant conditions;Meanwhile,the superiority of the flow rate of the new air pump device developed in this paper is proved by comparing the input flow rate,output flow rate,inlet instantaneous flow rate and outlet instantaneous flow rate curves of the new synthetic jet piezoelectric air pump and the conventional synthetic jet piezoelectric air pump under resonant conditions.Secondly,a four-factor,three-level experimental study was conducted to investigate the effect of four main design indexes on the flow rate of the new piezoelectric air pump,including cavity height,pump cavity height,outlet orifice diameter and jet orifice diameter.The response surface method was used to develop a corresponding quantitative and qualitative analysis on the effects of the main and interaction effects of the four factors on the flow rate in terms of regression equations and standardized effect diagrams,and the optimal parameters were screened by the response surface optimizer.Finally,the heat dissipation experimental platform with a synthetic jet generation system,an electronic chip heating simulation system,and a temperature information acquisition system was built,and three groups of comparative impact heat dissipation experiments were conducted on the piezoelectric pump prototypes with the worst and best flow performance,and the positive correlation between flow performance and heat dissipation performance was confirmed by the magnitude of temperature change of the piezoelectric pump before and after optimization.In addition,the effect of the distance between the piezoelectric pump and the heat sink on the heat dissipation performance of the piezoelectric pump was investigated and the optimal impact heat dissipation distance was derived.The experimental results show that the specific structural parameters of the prototype piezoelectric pump with the best working capacity are: 1.3 mm cavity height,0.5 mm pump cavity height,1.5 mm outlet hole diameter,and 0.8 mm jet hole diameter,which gives the best output flow rate of 1832.3 mL/min.At the same time,the piezoelectric air pump obtained the best heat dissipation effect at a relative heat dissipation distance of 20 mm.The piezoelectric air pump can not only meet the heat dissipation requirements of small electronic cooling devices,but also improve the integration of the air pump by reducing the geometry of the air pump,which provides a new idea for the development of the piezoelectric air pump.