Experimental Study Of New CPU Heat Sink Based On Silk Screen

With the continuous development in the field of computers,the performance of CPUs is becoming more and more powerful,but at the same time,it also brings a higher demand for heat dissipation.The purpose of this study is to investigate a new CPU cooler based on wire mesh,and to explore it by both numerical simulation and experimental study.Finally,after experimental error analysis,it is synthesized that the new CPU heat sink has good heat dissipation effect and can replace the Fin-through aluminum fin heat sink for CPU heat dissipation.The main research contents are as follows:(1)In the numerical simulation study,the simulation calculation results of six different wire sizes of purple copper wire with the same heat dissipation rate were compared,and it was concluded that 0.3 mm copper wire is the best wire size for this experimental study.In addition,the forced convection heat dissipation effects of the same size copper wire mesh and aluminum mesh were compared for natural convection and four wind speeds(1m/s,1.5m/s,2m/s,2.5m/s).The simulation results show that the temperature of the aluminum sheet is18℃ higher than that of the copper mesh under natural convection,while the temperature of the copper mesh is lower than that of the aluminum sheet under forced convection in all cases,26.4℃,24.6℃,24.2℃,and 22.8℃,respectively.(2)The experimental study used purple copper mesh as the raw material for heat dissipation and produced a serpentine structure by tinning as well as folding process,and finally five new CPU copper mesh heat sinks were designed.The thermal effect and thermal resistance of these five new heat sinks were compared with the current best through Fin type aluminum fin heat sinks.The experimental results show that the thermal resistance of the produced new CPU heat sinks Sample 1,Sample 2 and Sample 3 is lower than that of the aluminum fin heat sinks.After comprehensive analysis of the experiments,it was concluded that sample 1 had the best performance with a thermal resistance of about 0.51℃/W,while the thermal resistance of the aluminum fin heat sink was 1.04℃/W.The thermal resistance of the designed new CPU heat sink was reduced by about 50% compared to the aluminum fin heat sink.(3)In addition,experiments were conducted on sample 1 and the aluminum fin heat sink at five different wind speeds(1.62m/s,2.33m/s,3.41m/s,4.16m/s,5.12m/s),and the convective heat transfer coefficients(h)of the two heat sinks were calculated at different wind speeds,and it was found that the convective heat transfer coefficient(h)of the new CPU heat sink was greater than that of the aluminum fin heat sink.The convective heat transfer coefficients(h)of the two heat sinks were found to be: sample 1(874.42W/m2℃)and original aluminum fin heat sink(150.12W/m2℃)at a CPU fan wind speed of 4.16m/s and heating power of sample 1 and original heat sink(36W and 38.34W),respectively.about500%.