Research On High-efficiency Injection Molding Packaging Equipment And Technology For Microelectronics

With the continuous upgrading of intelligent equipment,the manufacturing capacity of high-performance electronic components is facing serious shortages,and high-efficiency microelectronic packaging technology has become a hot spot in the field of electronic material processing research.The packaging quality and packaging efficiency of different packaging technologies are uneven.In recent years,with the increasing application of ultra-high-speed injection molding technology in the packaging industry,ultra-high-speed injection molding provides a new manufacturing solution for efficient microelectronic packaging.Based on the processing technology of high-speed injection molding and the mechanical characteristics of high-speed stamping of crank slider structure,this paper designs a microelectronic high-efficiency injection molding packaging platform for high-speed stamping structure in the field of microelectronic packaging.(1)Based on the high-speed preparation requirements of microelectronics injection and packaging,a high-efficiency injection and packaging equipment platform for ultra-microelectronics was designed using mechanical development related tools.Aiming at the structural performance problems caused by the alternating force of the platform under high frequency and high voltage operation environment,this paper uses the finite element software to study its main functional structure problems.(2)The co-simulation performance evaluation is carried out on the basis of the digital prototype of the designed microelectronics high-efficiency injection molding and packaging platform.Combined with dynamic simulation tools,the kinematic performance of the virtual prototype was explored;combined with the theory and analysis tools of modal superposition harmonic response,the reliability evaluation of the performance related to the resonance deformation of the mechanical platform under high-frequency shock was completed,Completing the study of the motion characteristics of the internal cavity fluid under high-speed stamping state of the equipment,The process parameters such as injection speed and injection pressure were verified by combining engineering fluid theory and co-simulation tool;According to the motion relationship of components in the platform,an efficient injection packaging process is designed;the evaluation results are consistent with it’s theoretically designed injection speed and new packaging process requirements.(3)Based on the design,performance evaluation,and determination of action parameters of the microelectronics high-efficiency injection molding packaging platform,And run the process parameters on this packaging platform,the CAE mold flow analysis tool is used to carry out targeted and relevant virtual simulation experiments on microelectronic component products,and to explore the process quality rules of efficient packaging of microelectronic components.At the same time,in order to expand the application of the packaging platform,combined with the explored process performance rules,the injection and packaging experiments of heterogeneous microelectronic components were carried out,and the evaluation results were suitable for the diversified packaging requirements of actual products.