Interfacial Assembly And Modification For Insulation Coating By Boron Nitride Nanotube Of The Metal Substrate

As the specific volume power of electronic products continues to increase,the heat dissipation limits the development of electronic products to miniaturization and high-power density.The most widely used printed circuit board material is the metal-based copper clad laminate,among them,the aluminum substrate accounts for the highest proportion,and the core technology is to improve the thermal conductivity of the insulating medium layer.This thesis aimed preparation of high temperature resistance and thermal conductive electrical insulating materials by orthogonal experiment,E12 epoxy resin,phenolic resin and phenoxy resin are used as the matrix,the different diameters of alumina and a small amount of nano-boron nitride are used as the filler.Meanwhile,aluminum-based copper-clad laminate was prepared,while was assembled of porous anodic alumina utilizing composite,then research and testing analysis on the thermal conductivity,insulating property,peeling strength and thermal stability.The aluminum plate form nano-pore structure alumina film on the surface by electrochemical oxidation,and alumina film use as interfacial assembly matrix because of high thermal conductive.However,the industry produces a great variety of aluminum plates which is different of thermal conductivity,pressure resistance,mechanical properties and heat resistance of the anode aluminum plates inconsistent.There are three kinds of aluminum plate which demand of thermal conductivity,pressure resistance,mechanical properties and heat resistance after electrochemical oxidation.Using orthogonal experiment with 4 factors and 3 levels,it is in order to prepare high temperature resistance and thermal conductive electrical insulating materials,then exploring the effect of E12 epoxy resin,phenolic resin,phenoxy resin and filler on thermal conductivity,peel strength,resistivity and thermal stability.The experimental results show that the highest thermal conductivity of the insulating composite material is 1.99 W/(m?K),the maximum peel strength is0.98N/mm,the resistivity is 0.45～0.57×10~8Ω·m,and the main thermal decomposition temperature is above 400℃.In this thesis,porous alumina templates were obtained by one and two-step anodization respectively,then interfaced assembly of alumina template with compound material.The experimental results show that in terms of thermal conductivity,the effect of two-step anodization assembly is higher than one anodization assembly.The thermal conductivity of the whole board is16.114 W/(m?K),which is 16.17%lower than the anodization aluminum plate,which is 19.452W/(m?K),and the withstand voltage increase from less than 1k V to more than 3.5k V,The peel strength is also improved.