Cutting Process Parameters And Quality Optimization Of Grinding Wheel Dicing Saw

The grinding wheel dicing saw is one of the core devices in the back-end packaging of the chip processing process,and is used to make powerful cuts in various materials by rotating the spindle with blades at high speed.Due to the physical processing characteristics of the dicing saw,a fixed width of space is required as a reserved scribe street during processing.In order to improve the productivity of modern semiconductor manufacturing industry,it is necessary to strictly control the width of the reserved scribing street on the wafer,but the hard and brittle materials such as silicon wafers are very easy to produce edge chipping and cracking during the physical scribing process,thus causing damage to electronic components.At present,the domestic dicing saw market independent research and development machines in terms of precision,cost and other aspects is not as good as foreign brands,less independent research and development machines,resulting in expensive equipment purchases,long delivery cycle,to a certain extent,limiting the development of China’s semiconductor packaging field.In order to improve the market share of domestic dicing saw and promote the rapid development of the domestic semiconductor packaging field,this paper conducts an in-depth study on the scribing quality of 12-inch dual-axis automatic dicing saw,investigates the relationship between the main components of the dicing saw and the scribing parameters on the scribing quality,and optimizes the scribing process parameters of the dicing saw.The main research contents are as follows:(1)The development status of domestic and foreign production of dicing saw equipment is discussed,the characteristics of domestic and foreign dicing saw production are compared,the shortcomings of domestic dicing saw compared with foreign dicing saw in some aspects are given,and various methods to optimize the scribing quality of dicing saw are proposed.(2)The overall structure of the dicing saw and the functions of each molecule are introduced,the working principle and process of the dicing saw are explained,and the main factors affecting the scribing quality of the dicing saw and the quality evaluation index are given.(3)An orthogonal regression test method was introduced to collect data and complete the modeling.The relationship between the main components of the dicing saw and the scribing process parameters and the scribing quality was studied,and the common problems in the processing of the dicing saw and their solutions were given.(4)The genetic algorithm and particle swarm algorithm are improved according to the characteristics of the actual problem,and the parameters are optimized on the orthogonal regression model,and finally the calculated cutting parameters are verified by repeated experiments.The experimental results show that the combination of the orthogonal regression test method and the intelligent optimization algorithm can effectively improve the cutting quality of the dicing saw,and then improve the yield of the dicing saw.