Error Modeling And Analysis Of The Grinding Wheel Dicing Saw

The grinding wheel dicing saw machine is a kind of high-precision equipment spread used to cut semiconductor wafers.With increasing requirements and growing market demands on semiconductors,the dicing saw machine needs to be capable of operating for a long time with the accuracy maintaining and the time of maintenance and debugging minimizing.The decreasing accuracy of dicing saw machine is the direct reason of cutting error of the machine.Hence,the level of accuracy and stabilization of dicing saw machine become the main consideration when people plan to buy such type of machine.A dicing saw machine sponsored by Shenyang instrument institution is selected as a target object in this paper.The principal factors which have great influence on the cutting errors are figured out and these reasons are then analyzed in terms of the decreasing cutting accuracy.And certain solutions are come up with to improve the machine's accuracy.Besides,selection of machine's components,verification for the scheme and 2-D graph for a dicing saw machine based on 3-D model are finished with the help of interviews with workers and surveying.Another important job in this paper are that some shortcomings are modified due to previous analysis.The dicing saw machine is separated into five systems:the system of Z axis,the system of Y axis,the system of X axis,air static pressure main shaft system and the absorption system for components,which also lay a solid foundation for later function analysis;Motion error modeling is set up based on the characteristics of dicing saw machine.And then the model is employed to calculate the sensitivity of every components and analysis.The model has been verified by virtue of MATLAB software.Ultimately,real errors are introduced to judge the correctness and university of motion error model based on 3-D model established previously.