Design And Optimization Of Package Structure For Iris Recognition Camera Module

Iris recognition is currently one of the safest and most reliable biometric technologies.It has the advantages of uniqueness,high stability,high accuracy,and non-contact.It is widely used in information security,industrial and mining,banking and finance,public security,access control and attendance,key areas such as airport security.The traditional iris recognition module is mainly based on board-level assembly and surface mount technology,which has problems such as large volume,low integration,and high power consumption,and it is difficult to meet the development needs of miniaturization and low power consumption.To solve the above problems,this paper optimizes the packaging design of a board-level iris recognition camera module(the size is 40×22×15mm)developed by a company,based on Si P technology and film-assisted plastic packaging technology,the packaging structure design of the iris recognition camera module is carried out,and the thermodynamic performance analysis is carried out through the ANSYS finite element simulation software,and optimization is carried out on this basis.The specific research content and results are as follows:(1)The packaging structure design of the iris recognition camera module.Including CIS chips,IC chips,passive devices,and other components,based on Si P and film-assisted plastic packaging technology,two packaging structures of BGA and QFN are designed.Mainly include a substrate,lead frame,plastic package,lens holder and solder balls,and other parts of the design.The total package sizes of the two designed iris recognition modules are 7×7×1.2mm and 8×8×1.35 mm respectively.(2)Simulation analysis and optimization of the mechanical performance of the iris recognition camera module package.First,a mechanical simulation model of the iris recognition camera module is established to analyze the mechanical properties of a block during the cooling process.Secondly,a single factor variable was used to analyze the influence of different structures and material parameters on the package warpage of two iris recognition camera modules.Finally,to reduce package warpage,the structures of the two models were optimized.The simulation results show that under the initial conditions,the package warpage of the model adopting the BGA package structure is smaller,and the influence of DA thickness on the package warpage of the two models is significantly different.The order of influence of each factor on the warpage of the two models is the same: opening size,DA thickness,and IC chip thickness.After further optimization,the package warpage of the two models was reduced by 24.81% and 6.12% respectively.(3)Simulation analysis and optimization of thermal performance of iris recognition camera module package.First,a heat dissipation simulation model of the iris recognition camera module is established to analyze the heat dissipation performance of a single module in service.Secondly,a single factor variable is used to analyze the influence of different structure and material parameters on the junction temperature and thermal resistance of the iris recognition camera module.Finally,to reduce the junction temperature and thermal resistance of the package,the structure and material parameters of the two models were optimized.The simulation results show that: under the initial conditions,the heat dissipation performance of the model using the QFN package structure is better,but the optimal combination of junction temperature and thermal resistance in the two models is not the same group.After further optimization,the junction temperature of the two models was reduced by 32.12% and 33.16% respectively,the thermal resistance was reduced by 31.10% and 37.90% respectively.