Research On Thermo-piezoeiectric-mechanical Coupling Analysis Of Unsymmetrical Piezoelectric Laminated Plate

Considerable attention is paid to the research of thermo-piezoelectric-mechanical coupling problem on piezoelectric intelligent structures. A comprehensively coupled thermo-piezoelectric-mechanical model of composite laminates with single surface bonded piezoelectric materials, subjected to externally applied loads, is developed. A second-order piezoelectric field is developed to more accurately model the electric potential distribution through the thickness of piezoelectric laminae. A higher-order shear deformation theory, which is applicable to laminated plates with arbitrary stacking sequences, is used to describe the displacement fields to accurately model the transverse shear effects, which is significant in moderately thick constructions. A higher-order temperature field is used to accurately describe the temperature distribution through the thickness of composite plates. The governing differential equations are obtained by applying the finite element method. The analysis of statics and dynamics is implemented.The numerical results indicate some important observations. Firstly, comparisons with ANSYS, for both the electric field and the displacement field, are presented to validate the second-order piezoelectric theory. Secondly, when thermal load is considered, the coupling has significantly different effects on the structure bonded piezoelectric materials with single surface, compared with that bonded piezoelectric materials symmetrically. Thirdly, thermal load has much less effect on vibration of the laminates. Finally, the coupling has significant effect not only on the static analysis, also on the dynamic analysis.