Research Of Processing Principle And Development Of Experiment Setup For Electroplated Diamond Wire Saw With Ultrasonic Vibration

Along with the rapid development of scientific research and industrial technology the application of hard and brittle material in all kinds of field become more and more popularize. These hard and brittle material including silicon crystal, quartz crystal, ceramics, gem, glass, rare-earth element and magnetic material, semiconductor material, hard alloy etc. In a great deal application of industry they required to machining geometry shape some of them required high precision.In the machining of hard and brittle material diamond wire saw has some unexampled adventures: small damage of machining surface, small deflection deformed, thin cutting slices, good identical of thickness dimension, can cutting big silicon, save material, good efficiency, big output, high efficiency etc. This is a new technology has great development during these years.A cutting method of electroplated diamond wire saw with ultrasonic vibration has self knowledge property right was reported in this paper. This subject has great research worth and factual application. The research contents include: the design and manufacture of experiment setup, this setup fulfilled the basic requires of experiment, the design and manufacture of the electroplated diamond wire saw fit for ultrasonic vibration. Has done motion and dynamics analysis and has developed the machining locus of electroplated diamond wire saw. The experiment research on technological parameter, remove rate, cutting force, surface qualities etc about electroplated diamond wire saw were carried out systematically. The research and analysis were carried on lose efficacy and mechanism. At the end the lose theory was carried on the theory analysis of fracture mechanics and cutting force through the analysis of electroplated diamond wire saw cutting process.A new cutting technology- electroplated diamond wire saw with ultrasonic vibration cutting technology was first research and development. This technology was different from former hard and brittle material cutting method, the principle was validated feasible through the design and manufacture experiment setup for electroplated diamond wire saw with ultrasonic vibration. Cooperate with other associate unites, research on electroplate techniques was done through homemade electroplate device ,manufacture stable quality electroplated diamond wire saw , strong combination of electro paint and body, good keep of electro paint to diamond grain, equality distributing of diamond grain, reach the use request of this technology. Design and manufacture ultrasonic power source, transducer, amplitude etc through the research of the key technology. Ultrasonic generator power is 250W (adjusting), frequency is 20 KHz; maximal swing of tool is 20μm.The experiment indicates this system has stable and credible work.Through lucubrate of electroplated diamond wire saw with ultrasonic vibration technique, experiment result indicates use this method remove rate exceeds 25mm/min is 2.5～3 times of the same condition of come and back wire saw, the adventure property of diamond was full exerted. The influences of the work piece nature were taken into account based on diamond grain, side force, and wire saw speed. The cutting techniques parameter was optimize on orthodox test. In order to ensure high cutting rate the best technique parameter: diamond grain is 180~#,side force is 12N,wire speed is 300rpm.The work piece surface roughness is Ra0.7～0.8μm has increase 1 time over come and back wire saw.The author considers during the cutting process the contact of grain and work piece is not continuous, the factual work time is 1/3～1/5 of the vibration cycle so the average cutting force and temperature is decrease, has the time and condition to release the force of the part generate and develop electroplated diamond wire saw cutting track were based on the motion and dynamics analysis of electroplated diamond wire saw and grain.The main failure forms are diamond grain abrasion, crash, brushing off based on lucubrate of electroplated diamond wire saw and mechanism. During the high speed cutting the impact of diamond grain lightened because of wire saw flexible,generally the main behavior is polishing rubdown do not engender crash and brushing off of machine impact. During low cutting speed, the diamond grain will crash and brushing off because of big cutting force. First the diamond grain get little stress and caloric in the sharp-angled and arras engender polishing rubdown or light local crash, along with increase of rubdown and local crash the carrying capacity decline some diamond grain engender whole crash. Diamond grain get machine impact engender whole crash because of friction engender great cutting heat make electro paint intenerate, decrease nickel-plate's hold of diamond grain .If parameter choose improper the life of wire saw will decrease even more parted.Cutting force theory model was made based on theory research of diamond wire saw cutting force .This model taking into account cutting speed, feed rate, wire saw parameter and work piece property to cutting force based on one grain cutting force. Research show that diamond wire saw direct ratio to the thickness and feed rate of work piece, inverse to wire saw cutting speed, and has something with material property. Electroplated diamond wire saw with ultrasonic vibration theory model was advanced based on research and analysis of the hard and brittle material lose theory, considers the main lose method of electroplated diamond wire saw with ultrasonic vibration cutting was Hertzian Fracture. If work piece surface was stretch pressed by a slip press head then after press head slippage locus material engender tensile stress field, when over critical usual burden will engender local taper crack .This burden less than the force make material surface engender permanent snick. This shows that in lower press hard brittle material still crashed. On this basis analyzed during electroplated diamond wire saw with ultrasonic vibration cutting including crack expand of compress condition, crack expand of extend condition, crack expand of cavitations condition and crack expand of hammer attack, impact and scroll cutting besides usual cutting. During the crack form, expand, close process upright and landscape orientation is different, upright crack dimension bigger than landscape orientation crack dimension and that landscape orientation crack dimension is the main factor of form the work piece roughness.