Font Size: a A A

Design And Technology Of Diamond Wire Saw Ultrasonic Compound Processing System

Posted on:2017-04-15Degree:MasterType:Thesis
Country:ChinaCandidate:X ShanFull Text:PDF
GTID:2131330488492171Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
In recent years, more and more new materials are widely used, in which the non-metallic brittle materials usage are significantly increased. A ceramic material as the representative of the advantages of rigid material of high hardness, wear resistance, good stability, anti-aging, resistance to environmental corrosion. This paper by reciprocating diamond wire saw cutting on the basis of applying ultrasonic vibration to the feeding direction, the cutting mechanism of the device is analyzed, and experimental research process more practical reference value.Based on WEDM structure, combined with ultrasonic vibration technology to complete the design of the ultrasonic composite wire saw cutting device and technology research. The following work and research are completed:(1) Established the mechanical model of interacting between diamond particles and brittle materials. The theory of the way and cut the material removal effect are predicted combined with ultrasonic machining vibration theory.(2)Complete a wire saw cutting machine to improve the working mechanism of the body. Completed the ultrasonic generator design; complete sandwich ceramic transducer design; to complete the design tapered ultrasonic horn.(3) In order to study the material cutting process, using a jig slidably completed constant pressure system design; three-dimensional dynamometer cutting force measurement system design.(4) To wear for the processing of alumina ceramic objects by changing the processing parameters for cutting hard and brittle materials, cutting experiments are studied cutting parameters on material removal efficiency and the quality of relationships.After the diamond wire saw ultrasonic composite cutting device design is completed and the experimental device designed to meet the following requirements: The need to ensure a smooth diamond wire saw motion when the machine body debugging. Through NC programming can be achieved diamond wire saw cutting direction automatic feed and rapid retreat. Spindle speed stepless adjustment and wire sawing yarn tension stepless adjustment are needed. Automatic cutting fluid circulation means. Ultrasonic generator has adjustable frequency, power adjustable features, along with circuit protection and frequency tracking. Transducer and horn after installation commissioning can achieve the desired effect of vibration, ultrasonic vibration frequency of the design is complete 25 kHz, power of 250 W. Force measuring device is stable and reliable, the data recorded without exception.The main feature of the device for the introduction is the ultrasonic composite processing technology. Applying ultrasonic vibration and without comparative experiments show that:After the application of ultrasound, the material removal rate is 1.5 to 2.5 times.Further, cutting experiments also show:With the increase of the line speed of wire saw, the material removal rate surface quality is better. Increasing the cutting speed will decrease the cutting force between the wire and material to improve the surface quality. With the increase of lateral pressure, material removal rate significantly improved. But the surface quality degradated. Because cutting force will increase the lateral pressure accordingly increase material removal rate. The coolant is of great influence when applied to the machining. Material removal rate and surface quality improved both. Because cutting fluid washed cutting away, preventing wire saw work surface chip jamming and improve cutting efficiency. The data is more obviouse when using a low pressure and with coolant liquid. So that the ultrasonic cavitation liquid improved material removal rate and surface quality are beneficial.
Keywords/Search Tags:Diamond wire saw, Ultrasonic machining, Hard brittle materials processing, The material removal rate, Sawing force, The composite processing
PDF Full Text Request
Related items