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Research On Manufacturing Technology Of Ultraviolet-curing Diamond Wire Saw

Posted on:2010-12-23Degree:DoctorType:Dissertation
Country:ChinaCandidate:F Q LiuFull Text:PDF
GTID:1101360272479012Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
New technical challenges have been posed to the traditional machining tools applied to semiconductor hard brittle materials with the development of the modern semiconductor material towards the big specification, the high accuracy, the high efficiency and the low cost. Based on the research on ultraviolet-curing grinding tool, the thesis studied manufacturing technology of ultraviolet-curing diamond wire saw in respect of material performance, bond strength, coating curing technology and processing properties etc., aiming at the technology target use of ultraviolet- curing resin as a bond for fixed-abrasive diamond wire saw.(1) Mechanical physical performances of ultraviolet-curing resins were studied. According to technical requirement of the wire saw work condition, the selection principles of material performances have been brought forward. By these principles, ultraviolet-curing resin types conforming to manufacturing technical requirement of the wire saw have been determined after the mechanical physical performance experiments and overall evaluation.(2) Core wire materials and properties of boundary surface were studied. The materials and varieties of core wires of ultraviolet-curing wire saw have been selected by technical requirement of the wire saw work condition for material strength. According to characteristics of metal and non-metal core wire, the respective experimental studies about surface treatment and technological conditions have been carried out to improve the interfacial bond strength between ultraviolet-curing and core wire.(3) Retention mechanism of diamond in agent was studied. The mechanical model of diamond embedded in ultraviolet-curing resin and evaluative experiment model of tensile test have been established. According to main bond theory, the methods were devised to improve the retention ability of embedded diamond in ultraviolet-curing wire saw.(4) The coating and curing technologies of wire saw were studied. The manufacturing technological process of wire saw was formulated in terms of technology of ultraviolet-curing wire saw. A wire saw coating curing machine has been developed. Furthermore, the quality control of coating and curing technologies were studied.(5) Wear failure mechanism and machining performance of ultraviolet-curing wire saw were studied. Based on the analysis of wear failure forms of ultraviolet-curing wire saw, the factors and mechanism that affected wear failure were studied. An evaluation method was established. Many experimental researches were carried out to study the improvement of performance of wire saw achieved by modifying resin using monomer and pretension technology for not-metal core wire. The comparison and evaluation of machining performance were conducted between ultraviolet-curing wire saw and commercial electroplated wire saw.
Keywords/Search Tags:ultraviolet-curing, ultraviolet-curing resin, wire saw, diamond, grinding tool
PDF Full Text Request
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