| The thickness of silicon photovoltaic industry currently used is more and moresmall, this is the traditional PV industry hard and brittle materials with a cutting toolmade huge technical challenge. Because of the quality of the new resin bond diamondwire saw slicing is better than electroplated diamond wire saw, and resin bondeddiamond wire saw manufacturing costs lower, process is simple, therefore expected tobe widely used in the field of photovoltaic industry with cutting hard and brittlematerials. Aiming at the new resin bonded diamond wire, some research work has beendone and the achievements are as follows:(1)According to the processing conditions, surface copper wire was selected asthe core of the resin bonded wire; meanwhile by the analysis of abrasive resin, thediamond powder which average particle diameter is10～20μm was chosen as abrasive,and its surface was plated by nickel; meanwhile, epoxy-modified phenolic resinpowder, rubber-modified resin powder and939P resin powder were selected as theresin used in the experiment. In order to improve the resin toughness and wearresistance, additive was putted in the resin.(2)The mixing ratio of resin solution was designed, then according to theflexibility and the pencil hardness after heat-curing, the resin used to produce the wiresaw was selected. The binding force between the resin and the substrate was studied,by orthogonal test the final curing temperature and final curing time were optimized.(3)The coating and curing technologies were studied, and the manufacturingprocess was formulated, meanwhile, the coating equipment and curing oven werestudied.(4)The appearance and wear failure mechanism were studied in this thesis, itshowed exceptional outward appearance. Excellent slicing performance and good surface quality were obtained through cutting test. |
PDF Full Text Request