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Physical vapor deposition and metalorganic chemical vapor deposition of yttria-stabilized zirconia thin films

Posted on:1999-04-26Degree:Ph.DType:Dissertation
University:Northwestern UniversityCandidate:Kaufman, David YFull Text:PDF
GTID:1461390014970058Subject:Engineering
Abstract/Summary:
Two vapor deposition techniques, dual magnetron oblique sputtering (DMOS) and metalorganic chemical vapor deposition (MOCVD), have been developed to produce yttria-stabilized zirconia (YSZ) films with unique microstructures. In particular, biaxially textured thin films on amorphous substrates and dense thin films on porous substrates have been fabricated by DMOS and MOCVD, respectively.;DMOS YSZ thin films were deposited by reactive sputtering onto Si (native oxide surface) substrates positioned equidistant between two magnetron sources such that the fluxes arrived at oblique angles with respect to the substrate normal. Incident fluxes from two complimentary oblique directions were necessary for the development of biaxial texture. The films displayed a strong [001] out-of-plane orientation with the ⟨110⟩ direction in the film aligned with the incident flux. Biaxial texture improved with increasing oblique angle and film thickness, and was stronger for films deposited with Ne than with Ar. The films displayed a columnar microstructure with grain bundling perpendicular to the projected flux direction, the degree of which increased with oblique angle and thickness. The texture decreased by sputtering at pressures at which the flux of sputtered atoms was thermalized. These results suggested that grain alignment is due to directed impingement of both sputtered atoms and reflected energetic neutrals. The best texture, a {111} phi FWHM of 23°, was obtained in a 4.8 mum thick film deposited at an oblique angle of 56°.;MOCVD YSZ thin films were deposited in a vertical cold-wall reactor using Zr(tmhd)4 and Y(tmhd)3 precursors. Fully stabilized YSZ films with 9 mol% could be deposited by controlling the bubbler temperatures. YSZ films on Si substrates displayed a transition at 525°C from surface kinetic limited growth, with an activation energy of 5.5 kJ/mole, to mass transport limited growth. Modifying the reactor by lowering the inlet height and introducing an Ar baffle ring increased the growth rates to 2.5 mum/hr. Dense, gas impermeable 4--6 mum YSZ thin films were deposited on porous (La,Sr)Mno3 cathode substrates. Solid oxide fuel cells, fabricated by sputtering on a Ni-YSZ anode, achieved open circuit voltages ≥94% theoretical, and maximum power densities at 750°C comparable with commercial conventional SOFC's operated at higher temperatures.
Keywords/Search Tags:Vapor deposition, YSZ thin films were deposited, DMOS, Oblique, Sputtering
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