New Processes And Applications Of Extreme Manufacturing Based On High Energy Charged Particle Beam

The scale,precision,dimension,speed,and fidelity are the most important indicators to evaluate the manufacturing capabilities.The extreme manufacturing refers to the technology that pushes the related indicators of manufacturing capability to the limit,such as manufacturing in extremely small scale,extremely high precision,multi-dimensional,high speed,high fidelity,and extreme environments.At present,high-energy charged particle beam lithography has the highest resolution and is the most flexible micro-nano manufacturing method,which has been widely applied in the fields of physics,materials science,nano-electronics,communications,anti-counterfeiting and so on.With the continuous deepening of industrial demand and basic research,the research on extreme manufacturing of high-energy charged particle beams has become a research hotspot in recent years.However,high-energy charged particle beam lithography is facing problems such as limited resolution compared to the ultrasmall beam spot size,poor pattern transfer accuracy,difficult processing of high aspect ratio structures,slow processing speed,and easy damage of target material caused by wet development.Based on the concept of extreme manufacturing,the aim of this work is to push the high-energy charged particle beam lithography capabilities to the limits.In this thesis,a series of new processes are proposed to improve the manufacturing scale,precision,speed,fidelity and other capabilities of high-energy charged particle beam lithography.Through the combination of experiment and simulation analysis,the related physical mechanism and application research are explored.Specific research contents are as follows:(1)We proposed the exposure of inorganic photoresist hydrogen silsesquioxane(HSQ)by high-energy single Ge V heavy ions and got the high-aspect-ratio structures with an average diameter of 2.5 nm,beyond the resolution limit of traditional electron beam lithography.The physical mechanism of high-energy single Ge V heavy ions lithography and high resolution was studied by Monte Carlo simulation,theoretical calculation,and comparative experiments.It also provides a new idea for the development of extreme high resolution lithography equipment and the evaluation of the resolution limit of photoresists.(2)A new high fidelity pattern transfer process by combining ‘conformal filling,SOG flattening and ion beam polishing’ was proposed to achieve better fidelity,surface roughness and device performance compared with traditional processing,and the applications on optical filters and refractive index sensing were demostrated.By means of atomic layer deposition and mechanical stripping,self-aligned 10 nm nanogap structures of heterogeneous metals,which are difficult to achieve by traditional methods,can be prepared reliably.In brief,it provides a feasible solution for the fabrication of micro-nano structures with extremely high shape accuracy and position accuracy.(3)Inspired by kirigami,a nanokirigami strategy of resist was proposed,which enables the extremely high efficiency processing of wafer-level chip multiscale nanostructures.For example,the processing efficiency of a disk with a diameter of800 (?)m can be increased by ten thousand of times compared to traditional method.Through mechanical measurement and simulation analysis,mechanical mechanism was explored.Based on the advantages of anti-corrosion kirigami strategy,its applications in optical super transmission(EOT),surface enhanced Raman scattering(SERS)and two-dimensional transistors were presented.In short,the strategy proposed in this work has solves the low efficiency of high-energy charged particle lithography caused by serial manufacturing,greatly improves the processing efficiency and precision,realizes unique structures,that are difficult to be achieved by traditional method,expands process of lithography technologies,and will play an important part in the efficient manufacturing of multi-scale functional structures.(4)A new paradigm of mechanical lithography and a new concept of mechanical resist are proposed based on the essence of lithography.Firstly,it has realized the mechanical lithography pattern processing of functional materials,such as metals,semiconductors,oxides,polymers,and quantum dots.The mechanism of mechanical lithography was studied by experiment and simulation.Secondly,aloe juice was used as a mechanical resist in a view of the new principle of mechanical lithography.Thirdly,based on characteristics of all-dry mechanical fabrication,the complex composition of perovskite quantum dots with high fidelity was realized.This work innovates the traditional paradigm of patterned photoresist solubilit y change caused by light exposure,thus attaining a new method of patterned photoresist interface mechanical properties change.It also broadens new horizons for the high-fidelity processing of ultrasensitive materials,the development of new photoresists and the realization of all-vacuum micro/nanoprocessing.Through the research on the new processes and applications of high-energy charged particle beam extreme manufacturing,this thesis puts forward a series of original schemes on the key issues such as scale,precision,speed,extreme condition s faced in the traditional lithography process.To a certain extent,it also promotes the development of lithography technology,which may have broad potential for the applications of high-resolution electron beam lithography and high-energy single ion lithography.