Dynamic Analysis On Mw1050 Automatic Die Cutting

Automatic Die Cutting is one of important devices for dealing with the surface in packing printing industry and intermittent paper feeding system is one of it's key components, which performance has a direct effect on the accuracy and the speed of Die Cutting. In this article, the kinetic characteristic of the intermittent paper feeding system of MW1050 Automatic Die Cutting produced by Shanghai Yahua Printing Machine Ltd. Co. was discussed in virtue of modern dynamic design analytics and digital signal analytics. The main contents and innovation are as follows:1. Centralized mass method was used to get the single-free-degree dynamic model of the mechanism and equivalent quality, equivalent rigidity and inhere vibrant frequency of the model were solved according to actual geometrical parameters.2. A testing system of actual running state of the mechanism was built using mechanical engineering testing methods and the corresponding program for collecting data was designed, which were applied to a MW1050 Automatic Die Cutting to measure actually and lots of datum available were obtained.3. According to the datum measured above, the modeling examination theory was used to solve the parameters of the single free-degree damped dynamic model which were then compared with the theoretical parameters. Thereby, not only were dynamic response differential equations more accurate, but also it turned out to be valid to introduce centralized mass method into the analysis of the mechanism.4. With the differential equations above, a simulated solve was got by dynamic response numeric methods. Then the syntactic order and the syntactic amplitude were worked out using syntactic analytics.5. The dynamic response results were analyzed and one of the chief reasons was discovered, i.e. the equivalent rigidity of the system is lower. Finally, some modified measurements were suggested to the manufacture.The thesis not only provide certain theoretical basis for the optimal design of Automatic Die Cutting, but also lay a foundation for further development of running state inspecting system of the device.