Research On Influences Of Microelectroforming Parameters On Mold Quality

As the rapid development of MEMS technology, microfluidic chip has become the focus in the domain of life science, chemistry, micro machine and so on. For his special advantages, hot embossing is used broadly in fabrication of polymer microfluidic chips, in which the quality of hot embossing mold influences the quality and application of the chips greatly. The fabrication of molds most likely use UV- LIGA technique, and microelectroforming which is the key process in UV- LIGA determines the precision of the molds greatly, so research on influences of microelectroforming parameters on mold quality has extensive significance.The dissertation introduces the technical characteristics, application and the research situation of microelectroforming, and through the combination of basic principles and experiments, establishes the microelectroforming parameters. After compared the techniques which named silicon mold, back board growing mold and backless board growing mold, the backless board growing technique has been estabished to fabricate mold. And through the analysis of the phenomenon of hydrogen evolution the solutions have been found to solve pinhole and dot exsisted in mold.As the precision of mold's figure will directly influences the shape of channels which are replicated by hot embossing, so the researches on the width and height are carried on. The rules of photoresist swelling are researched firstly, and then relevant measures are adopted to guarantee the precision of mold's width. On the basis of the analysis of the reasons of mold's uneven height, corresponding measures are proposed to solve the phenomenon of uneven height.Finally the principles of mold adhesion are discussed, and the influences of technique parameters on adhesion are also analyzed. Moreover mold's adhesion is strengthened through optimizing parameters and the amount of adhesion is measured. Also mold's surface roughness is measured using relevant equipment and properly measures have been used to improve surface roughness. These molds have been used in the chips' auto fabrication system successfully.