Design, Manufacture And Application Of An Unbalance And Close Magnetron Sputtering Equipment

The ion plating technique is one of the disciplines that develop quicker in the surface engineering technique. And it has been applied extensively in mechanical industry, metallurgy industry as well as space field. Ion plating equipments and technique of the tools are investigated in the paper. A completely new unbalance and close magnetron sputtering equipment is designed, which compared with the merits and drawbacks of some kinds of major technology, understood the domestic and foreign research results and trend of development and considered the current technology, economic condition and the key problems in production. This equipment has two direct current simple targets sputter source and two-twin targets intermediate frequency sputter source. And that a high-intensity source of ionization is introduced, which solved the problems such as the low ionization rate, low sputter speed rate and the weak reactive sputtering. Furthermore, the equipment can be used as research and development of multiple and multi-layer compound film such as layers of TiAlN TiCrN TiN TiC TiCN, as well as other simple substance layer or the alloy layer. The alignment and the optimization of performance are carried out, which reach the expect effect. At the same time, the technical study of TiC_xN_1-x is performed. The cutting experiment is made with precision hard alloy cutter covered by TiCN. The results show that the equipment has reached the level of the imported product. The technical study of TiAIN and TiCrN will be performed next step.