MCM Flip Chip Bonding Technology Research

This paper talks about the major supporting technologies for MCM package : the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding . On the basis of process testing and careful comparison of various approaches of chip mounting, chips interlinkage, flip chip bonding, bumps preparation, KGD and the under-fill processing, the advantages and characteristics of each process technique, as well as its discipline and process flowchart has been summed up and described in detail.Through comparison among three major ways of Chips Interlinkage, namely,Wire Bonding, Tape Automated Bonding and Flip Chip Bonding technologies. The advantages and disadvantages of each technology and their development orientations are analyzed, with the conclusion obtained that The Flip chip Bonding technology excels largely than the traditional Wire Bonding and TAB technologies, regarding the processing growth maturity, mounting and packaging efficiency, lead distance and I/O ends, etc.This paper also focus on introduction of various ways and methods of Flip Chip Bonding technology, which is mainly comprised of the following methods:thermal-pressing FCB,thermal supersonic FCB, reflow FCB(C4), epoxy resins optical-solidifying FCB, anisotropic electric polymer FCB, direct chip attaching(DCA), bump preparation through multi-layer substrate Flip impaction technology (B~2 it+FCA), and so on. Also, the approaches, processing flowcharts, disciplines, advantages and disadvantages, reliability as well as the extension of application of the above-mentioned processing technical ways and methods have been analyzed and studied in detail. Through practical experiments, weakness and strongness of several ways of FCB Bumps preparation, certain methods of Thermal FCB and Backfilling have been explored and compared. In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.