Development Of Adhesive Bonding Process And Equipment For Microfluidic Chip

The microfluidic chip integrates the basic operation units involved in the biological and chemical fields on a chip of a few square centimeters.It consists of various liquid reservoirs and interconnected microchannel networks,greatly reducing sample processing time,and Through the precise control of liquid flow,the maximum utilization efficiency of reagent consumables is realized,and the function of the entire laboratory,including sampling,dilution,addition of reagents,reaction,separation,and detection,is integrated on the microchip.The microfluidic chip shows great advantages,and it also shows an extremely wide application prospect in various fields.Microfluidic chip processing and manufacturing methods have become a research outlet.Packaging is an important step in the fabrication of microfluidic chips.Excellent packaging technology can improve the chip's life,reliability and reduce the impact of the environment on product performance.In the microfluidic chip packaging process,the common problem is the gap in the chip bonding.This article compares the characteristics of various microfluidic chip bonding technologies,selects adhesive bonding methods,and designs and manufactures special equipment for adhesive bonding,aiming to achieve large-scale,high-efficiency,low-cost microfluidic chip.manufacture.This article explored the microfluidic chip adhesive process(liquid adhesive bonding process,solid adhesive bonding process,proposed a new "sandwich" microfluidic chip processing technology),coating device design(mechanical structure design,electrical Control system design)studies in two aspects.First,four different liquid adhesives(UV glue,epoxy resin,and polydimethylsiloxane?UV pressure sensitive adhesive)were used to test the adhesion of the glass microfluidic chip.Two different methods were used to compare the spin coating with the roller coating.The glue method,it is concluded that the roller coating method is simple and quick and does not change the surface characteristics of the microchannel.The effects of adhesive layer thickness,bonding pressure and time on the bonding quality of microfluidic chips were studied.Finally,it is concluded that the UV-pressure-sensitive bonding method by roller coating is most suitable for the bonding method of the glass microfluidic chip,and there is no overflow phenomenon,and the process is simple and convenient for the largescale manufacture of the microfluidic chip.Secondly,the polymer PMMA microfluidic chip was selected as the research object,and NO.5601 solid adhesive was used as the binder for the microfluidic chip.The effects of temperature,pressure,and time for bonding on the bubble of the bonded chip are studied.The influence of various process parameters is systematically analyzed and summarized,and the best bonding process for solid-state adhesive bonding is obtained.Temperature:70°C,Bonding pressure: 0.3MPa,Bonding time: 15 min.Explore the new "sandwich" microfluidic chip processing technology.Then,the mechanical structure of the microfluidic chip gluing device is designed.The mechanical design of the gluing device includes the determination of the technical requirements of the gluing device,the determination of the mechanism scheme,the design of the key components of the device,the prototype design,and the mechanical assembly.Then the overall design of the control system of the glue application device was determined,and the entire process of the hardware design in the control system was introduced.With PLC as the control element,the X-axis and Y-axis motion control of the entire device is controlled by the vacuum system.The touch screen is selected as the human-machine interaction interface of the entire system,and the integrated control of the entire system is realized through the touch screen.Using this device,a large number of microfluidic chip bonding tests were performed,which proved the rationality and reliability of the device design.